ISOTROPICALLY CONDUCTIVE ADHESIVE SHEET AND CIRCUIT BOARD

WIPO Patent Application WO/2007/080842

A1

An isotropically conductive adhesive sheet that realizes simplification of the step of bonding a metallic reinforcing plate to a main body of circuit board and imparting of conduction reliability and electromagnetic shielding effect to the circuit board; and a circuit board obtained by the use of the isotropically conductive adhesive sheet. Isotropically conductive adhesive sheet (1) includes mold release film (2)and, superimposed on a surface thereof, isotropically conductive adhesive layer (3). Numeral 5 refers to a main body of circuit board (bonded portion only shown), 6 to an insulating layer, 7 to an electrode of copper, etc., and 8 to a reinforcing plate. The isotropically conductive adhesive layer (3) consists of a binder containing conductive particles (4). The conductive particles (4) consist of a metal powder, or low-melting-point metal powder, having an average particle diameter of 5 to 50 μm and are added in an amount of 150 to 250 parts by weight per 100 parts by weight of binder.

TERADA TSUNEHIKO (JP)
TOTOUGE MASAYUKI (JP)
MORIMOTO SYOHEI (JP)

PCT/JP2007/050062

July 19, 2007

January 09, 2007

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TATSUTA SYSTEM ELECTRONICS CO (JP)
TERADA TSUNEHIKO (JP)
TOTOUGE MASAYUKI (JP)
MORIMOTO SYOHEI (JP)

C09J7/10; C09J9/02; H05K9/00

WO2005031760A1

2005-04-07

JP2002256303A	2002-09-11
JP2005317946A	2005-11-10
JPH06308517A	1994-11-04
JPH01206575A	1989-08-18
JP2004263030A	2004-09-24
JP2005330409A	2005-12-02

KAJI, Yoshiyuki et al. (SUHARA & ASSOCIATES Recruit Shin Osaka BLDG. 14-2, Nishinakajima 5-chome Osaka 11, JP)

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