Title:
JOINED BODY, SUBSTRATE FOR POWER MODULE PROVIDED WITH HEAT SINK, HEAT SINK, METHOD FOR MANUFACTURING JOINED BODY, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE PROVIDED WITH HEAT SINK, AND METHOD FOR MANUFACTURING HEAT SINK
Document Type and Number:
WIPO Patent Application WO/2016/031770
Kind Code:
A1
Abstract:
A joined body in which an aluminum member comprising an aluminum alloy and a metal member comprising copper, nickel, or silver are joined, wherein the aluminum member is composed of an aluminum alloy having an Si concentration of 1-25% by mass, a Ti layer is formed at the portion where the aluminum member and the metal member are joined, and solid-phase diffusion-joining is used to join the aluminum member and the Ti layer, and the Ti layer and the metal member.
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Inventors:
TERASAKI NOBUYUKI (JP)
NAGATOMO YOSHIYUKI (JP)
NAGATOMO YOSHIYUKI (JP)
Application Number:
PCT/JP2015/073720
Publication Date:
March 03, 2016
Filing Date:
August 24, 2015
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/36; H01L25/07; H01L25/18
Domestic Patent References:
| WO2013065160A1 | 2013-05-10 |
Foreign References:
| JP2012160641A | 2012-08-23 | |||
| JP2007067258A | 2007-03-15 | |||
| JP2012104539A | 2012-05-31 | |||
| JP2014179463A | 2014-09-25 | |||
| JP2014177031A | 2014-09-25 |
Other References:
See also references of EP 3196929A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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