Title:
LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/145345
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a laminate that achieves excellent adhesion between a metallic layer and a resin layer. A laminate according to the present invention has a metallic layer, an adhesion layer, and a resin layer in the stated order. The resin layer contains a liquid crystal polymer. Either there are no gaps between the metallic layer and the adhesion layer or, if there are such gaps, there are no gaps having a long diameter greater than 10 μm and the number of gaps having a long diameter not greater than 10 μm is 100 gaps/m2 or less.
Inventors:
NAKAZAWA NAOKO (JP)
Application Number:
PCT/JP2022/047580
Publication Date:
August 03, 2023
Filing Date:
December 23, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/36; B32B7/12; B32B15/09
Domestic Patent References:
| WO2019142790A1 | 2019-07-25 | |||
| WO2010109842A1 | 2010-09-30 |
Foreign References:
| JP2016107505A | 2016-06-20 | |||
| JP6019012B2 | 2016-11-02 | |||
| JP2020053632A | 2020-04-02 | |||
| JP2014217992A | 2014-11-20 | |||
| JP2016182826A | 2016-10-20 | |||
| KR20200026461A | 2020-03-11 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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