LASER MACHINING DEVICE AND LASER MACHINING METHOD

WIPO Patent Application WO/2014/156687

A1

A laser machining device provided with a laser light source (202) for emitting laser light (L), a spatial light modulator (203) for modulating the laser light (L) emitted by the laser light source (202), and a light condensing optical system (204) for condensing the laser light modulated by the spatial light modulator (203) in a machining target (1). Multiple rows of reforming regions (7) include at least an irradiation-side reforming region positioned on a laser light irradiation side, an opposite-side reforming region positioned on the opposite side of the laser light irradiation side, and a middle reforming region positioned between the irradiation-side reforming region and the opposite-side reforming region. The spatial light modulator (203) displays an axicon lens pattern as a modulation pattern when the middle reforming region is formed, whereby laser light is condensed so that condensation points are formed in multiple positions aligned in proximity along the direction of laser light radiation, and the spatial light modulator does not display an axicon lens pattern as the modulation pattern when the irradiation-side reforming region and the opposite-side reforming region are formed, whereby machining quality is improved.

KAWAGUCHI DAISUKE (JP)
HIROSE TSUBASA (JP)
ARAKI KEISUKE (JP)

PCT/JP2014/056723

October 02, 2014

March 13, 2014

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HAMAMATSU PHOTONICS KK (JP)

B23K26/53; B23K26/064; B23K26/40; B28D5/00; C03B33/09; H01L21/301

WO2013039162A1

2013-03-21

US20100025387A1	2010-02-04
JP2006130691A	2006-05-25
JP2011002698A	2011-01-06

HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)

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