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Title:
LASER MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/003470
Kind Code:
A1
Abstract:
Provided is a laser machining device (1) wherein operability at the time of outputting machining laser light (L) after performing alignment using guide light is improved. An operation switch (35) that performs selective switching of the state of the laser machining device (1) is disposed in a laser head unit (3), said selective switching being performed among a first state wherein outputting of the machining laser light (L) and that of the guide light are prohibited, a second state wherein the guide light is outputted, and a third state wherein the machining laser light (L) is outputted. A user is capable of switching the laser machining device (1) from the first state to the second state, or from the second state to the third state by switching an operation lever (41) of the operation switch (35) from a first position (43) to a second position (44), or from the second position (44) to a third position (45).

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Inventors:
USHIRODA KOSUKE (JP)
WATANABE MITSUYOSHI (JP)
Application Number:
PCT/JP2017/045705
Publication Date:
January 03, 2019
Filing Date:
December 20, 2017
Export Citation:
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Assignee:
BROTHER IND LTD (JP)
International Classes:
B23K26/00; B23K26/03; B23K26/035
Foreign References:
JP2006280666A2006-10-19
JP2004041335A2004-02-12
JP2003140810A2003-05-16
JPS4312002Y11968-05-24
JPS4120771Y11966-10-07
JPH09323182A1997-12-16
JPH09220690A1997-08-26
JPH07163613A1995-06-27
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