Title:
LASER MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/261537
Kind Code:
A1
Abstract:
A laser machining device (100) comprises: a laser irradiation unit (1) that forms a machining groove (91) that has one end (t1) opening to an end section of a workpiece (90) and the other end thereof closed, as a result of scanning a workpiece surface (90S) from an end section of the workpiece (90) and laser machining the workpiece (90); and a nozzle unit (2) that sprays a gas across an irradiation zone (Z) of the workpiece surface created by the laser irradiation unit (1). The nozzle unit (2) is configured so as to increase the flowrate of the gas supplied to the irradiation zone (Z), from one end (t1) to the other end (t2) of the machining groove (91).
Inventors:
YOSHIDA KAZUHIRO (JP)
KOMATSU YOSHINAO (JP)
GOYA SANEYUKI (JP)
INOUE AKIKO (JP)
FUJIYA YASUYUKI (JP)
NARITA RYUICHI (JP)
SHIMIZU MASAHIKO (JP)
OZAKI RYOTA (JP)
KANI YUKI (JP)
KOMATSU YOSHINAO (JP)
GOYA SANEYUKI (JP)
INOUE AKIKO (JP)
FUJIYA YASUYUKI (JP)
NARITA RYUICHI (JP)
SHIMIZU MASAHIKO (JP)
OZAKI RYOTA (JP)
KANI YUKI (JP)
Application Number:
PCT/JP2019/025837
Publication Date:
December 30, 2020
Filing Date:
June 28, 2019
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B23K26/142; B23K26/082
Foreign References:
| JPS5550527B2 | 1980-12-18 | |||
| JPH1158748A | 1999-03-02 | |||
| JP6064228B2 | 2017-01-25 | |||
| JPS5519368B2 | 1980-05-26 | |||
| JP2001314986A | 2001-11-13 | |||
| US5747771A | 1998-05-05 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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