LASER MACHINING HEAD AND LASER MACHINING DEVICE

WIPO Patent Application WO/2020/090912

A1

This laser machining head (first laser machining head 10A) is equipped with: a housing (housing 11); an incidence part (incidence part 12) that is provided on the casing 11 and enables laser light to enter the casing; an adjustment part (adjustment part 13) that is arranged inside the casing and adjusts the laser light; and a light-condensing part (light-condensing part 14) that is attached to the casing, and that focuses and allows the laser light to be emitted to the outside of the housing. The distance between a third wall section (third wall section 23) and a fourth wall section (third wall section 24) opposing each other in a second direction (Y direction) is smaller than the distance between a first wall section (first wall section 21) and a second wall section (second wall section 22) opposing each other in a first direction (X direction). The housing is configured such that the housing is attached to an attachment part (attachment part 65) in a state in which at least one of the first wall section, the second wall section, the third wall section, and a fifth wall section are arranged on the attachment-part side of a laser machining device (laser machining device 1). The light-condensing part is arranged on a sixth wall section (sixth wall section (26), and is arranged offset toward the fourth wall section in the second direction.

SAKAMOTO TAKESHI (JP)
OKUMA JUNJI (JP)

PCT/JP2019/042625

May 07, 2020

October 30, 2019

Click for automatic bibliography generation  

HAMAMATSU PHOTONICS KK (JP)

B23K26/00; B23K26/046; B23K26/064

JP2011173129A	2011-09-08
JPH07214359A	1995-08-15
JP2017185506A	2017-10-12
JP2008066751A	2008-03-21
JP2013536080A	2013-09-19

HASEGAWA Yoshiki et al. (JP)

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