Title:
LEAD-FREE GLASS COMPOSITION, GLASS COMPOSITE MATERIAL, GLASS PASTE, SEALING STRUCTURE, ELECTRICAL/ELECTRONIC COMPONENT AND COATED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2017/126378
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a lead-free glass composition in which crystallization is suppressed and which has a low softening point. This lead-free glass composition is characterized by containing silver oxide, tellurium oxide and vanadium oxide, and further containing at least one compound selected from among yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, gallium oxide, indium oxide, iron oxide, tungsten oxide and molybdenum oxide as an additional component, and in that the content values (mol%) of silver oxide, tellurium oxide and vanadium oxide satisfy the relationships Ag2O > TeO2 ≥ V2O5 and Ag2O ≤ 2V2O5 when calculated in terms of the oxides, and in that the content of TeO2 is 25-37 mol.%.
Inventors:
NAITO TAKASHI (JP)
AOYAGI TAKUYA (JP)
MIYAKE TATSUYA (JP)
KONDO TAKESHI (JP)
KANEKO HIROKI (JP)
OKAMOTO KAZUTAKA (JP)
AOYAGI TAKUYA (JP)
MIYAKE TATSUYA (JP)
KONDO TAKESHI (JP)
KANEKO HIROKI (JP)
OKAMOTO KAZUTAKA (JP)
Application Number:
PCT/JP2017/000571
Publication Date:
July 27, 2017
Filing Date:
January 11, 2017
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
C03C3/12; C03C8/02; C03C8/16; C03C8/18; C03C8/20; C03C8/24; C03C27/06; H01J9/02; H01J9/24; H01J11/22; H01J11/48; H01L23/02; H01L23/10; H01L31/0224; H01L51/50; H05B33/04; H05B33/26
Domestic Patent References:
| WO2014073086A1 | 2014-05-15 |
Foreign References:
| JPH08502468A | 1996-03-19 | |||
| JP2013133342A | 2013-07-08 | |||
| JP2013132756A | 2013-07-08 | |||
| JP2013032255A | 2013-02-14 | |||
| JP2013032255A | 2013-02-14 |
Other References:
See also references of EP 3406574A4
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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