Title:
LEAD-FREE SOLDER ALLOY AND SOLDER JOINT PART
Document Type and Number:
WIPO Patent Application WO/2020/209384
Kind Code:
A1
Abstract:
The present invention is capable of forming a solder joint part, which has better physical characteristics than before and higher reliability than before while maintaining the melting point of a Sn-Bi-based solder alloy at a low level, by using a lead-free solder alloy containing 32-40 mass% of Bi, 0.1-1.0 mass% of Sb, 0.1-1.0 mass% of Cu, 0.001-0.1 parts by mass of Ni, and the remainder consisting of Sn and inevitable impurities, or a lead-free solder alloy further containing a specific element in a predetermined range.
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Inventors:
NISHIMURA TETSURO (JP)
Application Number:
PCT/JP2020/016201
Publication Date:
October 15, 2020
Filing Date:
April 10, 2020
Export Citation:
Assignee:
NIHON SUPERIOR CO LTD (JP)
International Classes:
C22C13/02; B23K35/26
Domestic Patent References:
| WO2015019966A1 | 2015-02-12 | |||
| WO2018028080A1 | 2018-02-15 |
Foreign References:
| JP2018121055A | 2018-08-02 | |||
| JP2014140865A | 2014-08-07 | |||
| JP2007090407A | 2007-04-12 | |||
| JPH0740079A | 1995-02-10 | |||
| JP5679094B1 | 2015-03-04 | |||
| JP2014140865A | 2014-08-07 |
Other References:
See also references of EP 3828294A4
Attorney, Agent or Firm:
YANAGINO Takao et al. (JP)
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