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Patent Searching and Data


Title:
LED FILAMENT AND LAMP, AND PRODUCTION PROCESS FOR LED FILAMENT
Document Type and Number:
WIPO Patent Application WO/2020/093664
Kind Code:
A1
Abstract:
Provided are an LED filament and lamp, and a production process for an LED filament. The LED filament comprises a PCB substrate and multiple LED chips, wherein a connecting circuit is arranged on the PCB substrate, two ends of the connecting circuit are respectively provided with an anode pin and a cathode pin, and each of the LED chip forms an electrical connection with the connecting circuit; and a fluorescent adhesive layer is arranged outside the PCB substrate and the LED chips, and the anode pin and the cathode pin are exposed from the fluorescent adhesive layer. The LED lamp comprises an LED filament. The LED filament can be produced by means of the production process for an LED filament. According to the LED filament and lamp, and the production process for an LED filament, the PCB substrate serves as a base material, and the connecting circuit is processed thereon and is directly used for connection to the LED chips without the need to solder same by means of a wire, thereby reducing processing costs and improving the processing efficiency and processing yield. According to the LED filament, the LED filament processed by means of the method has a more stable electrical connection structure, and is suitable for mass production.

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Inventors:
ZHANG GAOLE (CN)
ZHOU KANG (CN)
Application Number:
PCT/CN2019/084724
Publication Date:
May 14, 2020
Filing Date:
April 28, 2019
Export Citation:
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Assignee:
HANGZHOU BINARY OPTOELECTRONICS & TECH CO LTD (CN)
International Classes:
F21K9/20; F21V9/30; F21V19/00; F21V21/02; F21V23/06; F21Y115/10
Foreign References:
CN109253406A2019-01-22
CN107289342A2017-10-24
CN107289342A2017-10-24
CN104006321A2014-08-27
CN101793356A2010-08-04
CN202834825U2013-03-27
Other References:
See also references of EP 3677827A4
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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