Title:
LED LIGHT MODULE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO2006089033
Kind Code:
B1
Abstract:
An LED light module assembly (10) for use with high power, high light output LED's includes a thin flexible circuit board (22) with surface mounted LED's (12) and other electronic components which is attached to a metal heat sink (40) using a layer of a thermally conductive adhesive (46), such as a thermally conductive epoxy adhesive. A conduction path is provided from the LED carrier (16) through the flexible circuit board (22) by the incorporation of one or more thermally conductive vias (32) in the region of the attachment pad (38) used to bond the LED (12) to the flexible circuit board (22). These vias (32) provide a conduction path from the back side of the LED carrier (16) through the circuit board (22) to the thermally conductive adhesive (46) and heat sink (40). The LED light module assembly (10) has the capacity to dissipate between about 10-14 W of power without exceeding a maximum LED junction temperature of about 125°C.
Inventors:
BURKHOLDER GREG EUGENE (US)
Application Number:
PCT/US2006/005495
Publication Date:
October 04, 2007
Filing Date:
February 16, 2006
Export Citation:
Assignee:
FEDERAL MOGUL CORP (US)
BURKHOLDER GREG EUGENE (US)
BURKHOLDER GREG EUGENE (US)
International Classes:
F21V29/00; F21K99/00; H01L33/48; H01L33/32; H01L33/64
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