Title:
LINEAR GROOVE FORMING METHOD AND LINEAR GROOVES FORMING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/017908
Kind Code:
A1
Abstract:
Provided is a linear groove forming method for forming linear grooves on a steel plate surface using etching. This method allows linear grooves with a uniform shape to be formed while preventing deterioration of the magnetic characteristics of an oriented electrical steel plate caused by laser irradiation for removal of a resist. The linear grooves forming method comprises: a resist application step of applying a resist to the surface of an oriented electrical steel plate; a laser irradiation step of periodically performing laser scanning in the rolling direction of the oriented electrical steel plate to remove the resist in a part irradiated with a laser, the laser scanning comprising steps of irradiating the oriented electrical steel plate with the laser while scanning the laser in a direction transverse the rolling direction of the oriented electrical steel plate; and an etching step of forming a linear groove by etching the part of the oriented electrical steel plate from which the resist has been removed. The thickness of the applied resist is 0.5 to 10 µm. The laser output power is not less than 1500 W.
Inventors:
TAKAJO SHIGEHIRO (JP)
UESAKA MASANORI (JP)
UESAKA MASANORI (JP)
Application Number:
PCT/JP2016/003217
Publication Date:
February 02, 2017
Filing Date:
July 06, 2016
Export Citation:
Assignee:
JFE STEEL CORP (JP)
International Classes:
C21D8/12; B23K26/073; B23K26/364; C23F1/28; C25F3/06; H01F1/16
Foreign References:
| JPH11293340A | 1999-10-26 |
Other References:
See also references of EP 3330388A4
Attorney, Agent or Firm:
SUGIMURA, Kenji (JP)
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