LOW-EMI ELECTRONIC APPARATUS, LOW-EMI CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE LOW-EMI CIRCUIT BOARD

WIPO Patent Application WO/1996/022008

A1

A low-EMI circuit which realizes a high mounting density by converting the potential fluctuation of a power supply layer with respect to a ground layer which occurs on switching an IC device etc., into Joule's heat in the substrate without using any parts as a countermeasure against the EMI. Its structure, a circuit board using it, and a method of manufacturing the circuit board are also disclosed. Parallel plate lines in which the Q-value of the stray capacitance between solid layers viewed from the power supply layer and ground layer is equivalently reduced and which are matchedly terminated by forming a structure in which a resistor (resistor layer) and another ground layer are provided in addition to the power supply layer and the ground layer on a multilayered circuit board. A closed shield structure is also disclosed. This invention can remarkably suppress unwanted radiation by absorbing the potential fluctuation (resonance) which occurs in a power supply loop by equivalently reducing the Q-value of the stray capacitance, absorbing the standing wave by the parallel plate lines matchedly terminated and, closing and shielding the parallel plate lines.

AKIBA YUTAKA (JP)
NARIZUKA YASUNORI (JP)
TANEI HIRAYOSHI (JP)
KITAMURA NAOYA (JP)

PCT/JP1996/000021

July 18, 1996

January 10, 1996

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HITACHI LTD (JP)
AKIBA YUTAKA (JP)
NARIZUKA YASUNORI (JP)
TANEI HIRAYOSHI (JP)
KITAMURA NAOYA (JP)

H01L23/538; H01L23/552; H01L25/16; H05K1/02; H05K1/16; H05K9/00; H05K1/09; H05K1/11; H05K3/40; H05K3/42; H05K3/46; (IPC1-7): H05K3/46; H01L23/12

JPS60177696A	1985-09-11
JPH06132668A	1994-05-13
JPH02186694A	1990-07-20
JPH04230055A	1992-08-19
JPS6489393A	1989-04-03

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