Title:
LOW-FORCE ELECTROCHEMICAL MECHANICAL PROCESSING METHOD AND APPARATUS
Document Type and Number:
WIPO Patent Application WO2003028048
Kind Code:
A3
Abstract:
The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or holding the workpiece surface and a workpiece-surface-influencing-device (WSID). The WSID is used to uniformly distribute the applied force to the workpiece surface and includes various layers that are used to process and apply a uniform and global force to the workpiece surface.
Inventors:
BASOL BULENT M
UZOH CYPRIAN E
BOGART JEFFREY A
UZOH CYPRIAN E
BOGART JEFFREY A
Application Number:
PCT/US2002/030952
Publication Date:
February 03, 2005
Filing Date:
September 27, 2002
Export Citation:
Assignee:
NUTOOL INC (US)
International Classes:
B23H5/08; B24B37/04; B24B49/16; C25D5/06; C23F1/08; C25D5/22; C25D7/12; H01L21/304; H01L21/3205; (IPC1-7): C25D5/22; C25D7/12; C25F7/00
Domestic Patent References:
| WO2000026443A2 | 2000-05-11 | |||
| WO2000077278A1 | 2000-12-21 | |||
| WO2001013416A1 | 2001-02-22 | |||
| WO1999022908A1 | 1999-05-14 |
Foreign References:
| US20020121445A1 | 2002-09-05 | |||
| US6241585B1 | 2001-06-05 | |||
| US5762544A | 1998-06-09 | |||
| US6179690B1 | 2001-01-30 | |||
| US5810964A | 1998-09-22 |
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