Title:
LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USING THE BONDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/155615
Kind Code:
A1
Abstract:
Disclosed is a bonding material which enables the formation of a bonded article in a nitrogen atmosphere, can exhibit practically effective bonding strength without the need of carrying out any heat treatment procedure under pressurized or high-temperature conditions, and has reduced fluctuation in bonding between samples. The bonding material comprises: silver nanoparticles which have an average primary particle diameter of 1 to 200 nm and are coated with an organic substance having 8 or less carbon atoms; and a flux component which comprises a dispersion medium having a boiling point of 203°C or higher and an organic substance having at least two carboxyl groups. Particularly preferably, a combination of silver nanoparticles and submicron silver particles is used.
Inventors:
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
Application Number:
PCT/JP2011/063418
Publication Date:
December 15, 2011
Filing Date:
June 10, 2011
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
International Classes:
B22F9/00; B22F1/00; B22F1/054; B22F1/102; H01B1/00; H01B1/22; H01L21/52; H05K3/32
Domestic Patent References:
| WO2009116185A1 | 2009-09-24 | |||
| WO2010018782A1 | 2010-02-18 | |||
| WO2005025787A1 | 2005-03-24 | |||
| WO2009116185A1 | 2009-09-24 |
Foreign References:
| JP2006241494A | 2006-09-14 | |||
| JP2009007593A | 2009-01-15 | |||
| JP2007042301A | 2007-02-15 | |||
| JP2007095525A | 2007-04-12 | |||
| JP2010080438A | 2010-04-08 | |||
| JP2009267374A | 2009-11-12 | |||
| JP2009279649A | 2009-12-03 | |||
| JP4344001B2 | 2009-10-14 |
Other References:
MORITA ET AL.: "Development of Lead-Free Bonding Technique for High Temperature Environment Using Micrometer-Sized Silver Oxide Particles", MATERIA JAPAN, vol. 49, no. 1, 2010
See also references of EP 2581156A4
See also references of EP 2581156A4
Attorney, Agent or Firm:
HIROKOH MASAKI (JP)
Hiroyuki Masaki (JP)
Hiroyuki Masaki (JP)
Download PDF:
Claims:
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