Title:
MANUFACTURING METHOD FOR CONDUCTIVE FILM, LIQUID DISPERSION, RADIATION-SENSITIVE RESIN COMPOSITION, AND LIGHT EMITTING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2024/048270
Kind Code:
A1
Abstract:
The present invention provides a manufacturing method for a conductive film that has high conductivity and makes it possible to evenly fix a conductive carbon material over the entirety of a conductive film formation region. The present invention also provides a manufacturing method wherein it is possible to efficiently remove a dispersant that has remained in the conductive film, as well as a polymer that is in a section where a radiation-sensitive resin composition has not been subjected to light exposure. The present invention includes: a step (A) in which a liquid dispersion is applied on a main surface of a substrate and dried to form a first film, said liquid dispersion including a carbon material and a first polymer that has one type of functional group among a carboxyl group, a hydroxyl group, and a phenolic hydroxyl group; a step (B) in which a radiation-sensitive resin composition is applied on the first film to form a second film, said radiation-sensitive resin composition having an acid generating agent and a second polymer that has one type of functional group among a carboxyl group, a hydroxyl group, and a phenolic hydroxyl group; a step (C) in which the second film is exposed to light; and a step (D) in which, after the step (C), the first polymer and the second polymer are removed by developing.
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Inventors:
ICHINOHE DAIGO (JP)
KATSUI HIROMITSU (JP)
YASUDA HIROYUKI (JP)
KATSUI HIROMITSU (JP)
YASUDA HIROYUKI (JP)
Application Number:
PCT/JP2023/029520
Publication Date:
March 07, 2024
Filing Date:
August 15, 2023
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
B05D5/12; B05D1/36; B05D3/06; B05D3/10; B05D7/24; C09D5/24; C09D179/08; H05B33/28; H10K50/10
Domestic Patent References:
| WO2022181419A1 | 2022-09-01 | |||
| WO2022039034A1 | 2022-02-24 |
Foreign References:
| JP2000214585A | 2000-08-04 | |||
| JP2006281189A | 2006-10-19 | |||
| JP2022022537A | 2022-02-07 | |||
| JP2016087602A | 2016-05-23 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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