MATERIAL FOR THERMAL BONDING, COATING MATERIAL FOR THERMAL BONDING, COATING, AND ELECTRONIC COMPONENT BONDING METHOD

WIPO Patent Application WO/2012/081255

A1

Provided is a method for bonding metal components by metal microparticle sintering mediated by a metal sintered film, such that shorts do not occur readily between bonded sections, and bonding strength is higher than that achieved by plating or sputtering. A material for thermal bonding, obtained by dispersing metal microparticles (P) in an organic compound dispersion medium (A) that melts or softens through heating at a temperature higher than 30ºC, is interposed between members of identical or dissimilar type, selected from among metal members, semiconductor members and ceramic members. The material for thermal bonding is characterized in that 60 wt% or more of the organic compound dispersion medium (A) comprises one, two or more types of a polyol (A1) having a melting point or softening point of 30ºC or higher and having two or more hydroxyl groups in the molecule, and 80 wt% or more of the metal microparticles (P) comprises metal microparticles (P1) that are heat-sinterable and that have an average particle size of primary particles ranging from 5 to 200 nm.

ASADA TOSHIAKI (JP)
FUJIWARA HIDEMICHI (JP)

PCT/JP2011/007021

June 21, 2012

December 15, 2011

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FURUKAWA ELECTRIC CO LTD (JP)
ASADA TOSHIAKI (JP)
FUJIWARA HIDEMICHI (JP)

B22F1/0545; B22F1/107; B22F9/00; B23K20/00; C09J1/00; C09J11/04; C09J11/06; H01B1/00; H01B1/22; H01B5/14; H01L21/52; H05K3/32

WO2008065728A1

2008-06-05

JP2010202943A	2010-09-16
JP2005205696A	2005-08-04
JP2009140880A	2009-06-25

HOSOI, Isamu et al. (JP)
Isamu Hosoi (JP)

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