Title:
METAL ALLOY ELEMENTS IN MICROMACHINED DEVICES
Document Type and Number:
WIPO Patent Application WO2003053843
Kind Code:
A3
Abstract:
A microelectromechanical device, comprizing: at least one flexible member formed from an alloy comprising: one or more noble metals selected from the group consisting of gold, platinum and palladium; and one or more alloying elements, the elements selected from iridium, ruthenium, rhodium, palladium, gold, tungsten, osmium and nickel, wherein the one or more alloying elements form a solid solution with the one or more noble metals and wherein the one or more alloying elements are present in an amount sufficient to provide at least one performance characteristic at least 50% greater than the noble metal alone, said performance characteristic selected from the group consisting of yield srength, tensile strength and hardness.
Inventors:
BERNSTEIN JONATHAN JAY
TAYLOR WILLIAM PATRICK
TAYLOR WILLIAM PATRICK
Application Number:
PCT/US2002/039610
Publication Date:
October 09, 2003
Filing Date:
December 11, 2002
Export Citation:
Assignee:
CORNING INTELLISENSE CORP (US)
International Classes:
B81B3/00; C22C5/02; C22C5/04; C23C14/16; H01H1/00; H01H1/023; (IPC1-7): B81B3/00
Domestic Patent References:
| WO2000046852A1 | 2000-08-10 | |||
| WO2001056066A1 | 2001-08-02 |
Foreign References:
| US20010049193A1 | 2001-12-06 | |||
| EP1096523A2 | 2001-05-02 | |||
| US6239685B1 | 2001-05-29 |
Other References:
BECKER M ET AL: "Application of electroplating in MEMS-micromachining exemplified by a microrelay", MICRO MATERIALS 2000, BERLIN, GERMANY, 2000, vol. 7, no. 4, Microsystem Technologies, Nov. 2001, Springer-Verlag, Germany, pages 196 - 202, XP001154354, ISSN: 0946-7076
See also references of EP 1453759A2
See also references of EP 1453759A2
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