CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of and priority to U.S. Provisional Application No. 63/198,826, filed on November 16, 2020, which is hereby incorporated by reference in its entirety.

FIELD

[0002] The present disclosure relates to metallurgy generally and more specifically to metal coated substrates and techniques for improving battery current collectors and other substrates.

BACKGROUND

[0003] Thin metal films may be deposited onto surfaces by a variety of techniques. For example, electroplating may be used for depositing certain metals onto a surface. Electroplating, however, requires a conductive surface, and so non-conductive surfaces are not typically suitable for electroplating. Some metals, such as aluminum, may be difficult to deposit using conventional aqueous electroplating techniques since hydrogen ions are electrochemically easier to reduce than aluminum ions.

SUMMARY

[0004] The term embodiment and like terms are intended to refer broadly to all of the subject matter of this disclosure and the claims below. Statements containing these terms should be understood not to limit the subject matter described herein or to limit the meaning or scope of the claims below. Embodiments of the present disclosure covered herein are defined by the claims below, not this summary. This summary is a high-level overview of various aspects of the disclosure and introduces some of the concepts that are further described in the Detailed Description section below. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used in isolation to determine the scope of the claimed subject matter. The subject matter should be understood by reference to appropriate portions of the entire specification of this disclosure, any or all drawings and each claim. [0005] In an aspect, energy storage devices and energy storage device components are described herein. Example energy storage devices include batteries, double layer capacitors, also referred to herein as supercapacitors, and hybrid capacitors, also referred to herein as asymmetric capacitors. The energy storage devices may employ a substrate, such as a metal foil used as a current collector, and various other components. In one example, an energy storage device component comprises a current collector comprising a surface; and a metal coating deposited over at least a portion of the surface of the current collector. Advantageously, the metal coating and the current collector may comprise the same metal or metal alloy. Optionally, the metal coating and the current collector may comprise different metal alloys.

[0006] In embodiments, the current collector comprises a rolled metal product, such as a metal foil. Optionally, the current collector comprises aluminum, an aluminum alloy, copper, or a copper alloy. Optionally current collector has a thickness of from 0.005 mm to 0.5 mm. [0007] Advantageously, the metal coating may exhibit or provide a surface roughness that is greater than that of the surface of the current collector. By coating the current collector with a metal coating, a current collector having a relatively smooth surface may be processed to have a more rough surface. Such a roughened surface may allow for more intimate contact between the overlayer and the metal coating than between the current collector and the overlayer without the metal coating, which may provide for a number of unique advantages, including reducing a contact resistance between the current collector and the overlayer. Optionally, the metal coating exhibits an average surface roughness (Ra) of from 0.5 pm to 10 pm. Optionally, the metal coating and the current collector exhibit a collective surface area that is greater than a surface area of the surface of the current collector. Such an increased collective surface area may further contribute to a reduced contact resistance between an overlayer and the metal coated current collector because the contact area between the overlayer and the metal coating may be greater than the contact area between the overlayer and the current collector in the absence of the metal coating.

[0008] A variety of coating techniques may be used to deposit the metal coating. For example, in some embodiments, the metal coating is deposited using a technique selected from plasma-activated physical vacuum deposition, metal gun-spray deposition, electrochemical deposition, chemical deposition, or any combination of these.

[0009] The metal coating may have any suitable thickness. In some embodiments, it may be desirable to deposit very small thicknesses of metal coatings, so as not to increase an overall mass of the current collector very much. Example thickness may range from 5 nm to 100 pm. Optionally, the metal coating completely coats the surface of the current collector. In some cases, the metal coating only partially coats the surface of the current collector. [0010] In embodiments, the surface of the current collector comprises an oxide layer. In some cases, the metal coating may disrupt the oxide layer. Such a configuration may further contribute to a reduction in contact resistance, as an oxide layer may be nonconducting and the deposited metal coating may at least partially embed into and through the oxide layer, providing an improved conduction pathway between the oxide layer and an overlayer. Optionally, the metal coating and the current collector are calendered. Calendering may further contribute to disruption of the oxide layer, as the physical calendering process may similarly embed the metal coating at least part way into and/or through the oxide layer into a main structure of the current collector.

[0011] A variety of overlayers may further be deposited over the metal coating. For example, in embodiments useful in battery or other charge storage applications, the energy storage device may further comprise an electrode active material layer disposed over the metal coating. For example, the electrode active material layer optionally comprises one or more of an electrode active material, a conductive additive, or a binder. Useful electrode active material layers may have, but are not limited to, a thickness of from 0.1 mm to 50 mm. [0012] Optionally, the energy storage device may further comprise a conductive layer between the electrode active material layer and the current collector. Example conductive layers may further improve a contact resistance, a binding or adhesion, or a corrosion resistance between the current collector and the electrode active material layer. Optionally, the conductive layer comprises one or more of a carbonaceous material or a binder. In some cases, the conductive layer is positioned between the metal coating and the current collector. Optionally, the conductive layer is positioned between the electrode active material layer and the metal coating. Useful conductive layers may have, but are not limited to, a thickness of from 0.5 pm to 10 pm.

[0013] Other typical components may be present in an energy storage device. For example, an energy storage device may further comprise one or more of a second electrode active layer, an electrolyte, and a separator. In embodiments, the electrolyte and the separator are positioned between the first electrode active layer and the second electrode active layer. [0014] In another aspect, methods of making energy storage devices and energy storage device components are provided. An example method of this aspect comprises providing a current collector comprising a surface; and subjecting the surface of the current collector to a metal coating process to generate a metal coating layer over all or a portion of the surface of the current collector. In various embodiments, the metal coating process comprises plasma- assisted physical vapor deposition, plasma-activated physical vacuum deposition, plasma spray physical vapor deposition, vacuum plasma spraying, metal gun-spray deposition, plasma spraying, plasma transferred wire arc spraying, cold spraying, electro-chemical deposition, chemical deposition, sputtering, or dip coating. Optionally, the metal coating layer and the current collector comprise the same metal or metal alloy. As noted above, coating a current collector may modify one or more surface characteristics of the current collector, such as, but not limited to, a surface area of the current collector, a surface roughness of the current collector, a surface oxide layer, electrical conductivity, thermal conductivity, corrosion resistance, chemical reactivity, electrolyte reactivity, active material reactivity, wetting character, and/or adhesion character.

[0015] Formation of further overlayers over the metal coating may be useful for some applications. For example, in some embodiments, a method of this aspect further comprises subjecting the current collector or the metal coating layer to a coating process to form a conductive layer. Optionally, the conductive layer comprises one or more of a carbonaceous material or a binder. Optionally, a method of this aspect further comprises subjecting the current collector and metal coating layer to a coating process to form an electrode active material layer over the metal coating layer. Optionally, coating processes may comprise an immersion coating process or a roll-to-roll coating process.

[0016] In another aspect, coated objects are described herein. In some embodiments, coated objects may comprise a substrate; and an aluminum coating deposited over at least a portion of a surface of the substrate, such as an aluminum coating that exhibits a surface roughness that is different from that of the surface of the substrate. Optionally, the aluminum coating and the substrate exhibit a collective surface area that is greater than a surface area of the surface of the substrate.

[0017] A variety of different substrates may be useful for the coated objects described herein, including metal and non-metal substrates. In embodiments, the substrate comprises a rolled metal product, such as an aluminum sheet, aluminum foil, a copper sheet, or copper foil. Optionally, the substrate comprises an aluminum alloy, steel, magnesium, copper, a polymer, a glass, a ceramic, or a crystalline material. A variety of different coating processes may be used to deposit the aluminum coating over the substrate. For example, the aluminum coating may be deposited using one or more techniques selected from plasma-assisted physical vapor deposition, plasma-activated physical vacuum deposition, plasma spray physical vapor deposition, vacuum plasma spraying, metal gun-spray deposition, plasma spraying, plasma transferred wire arc spraying, cold spraying, electro-chemical deposition, chemical deposition, sputtering, or dip coating.

[0018] Other objects and advantages will be apparent from the following detailed description of non-limiting examples.

BRIEF DESCRIPTION OF THE FIGURES

[0019] The specification makes reference to the following appended figures, in which use of like reference numerals in different figures is intended to illustrate like or analogous components.

[0020] FIG. 1 provides a schematic illustration of preparation of an example coated substrate component

[0021] FIG. 2 provides a schematic illustration of coating of a substrate with multiple coatings.

[0022] FIG. 3 provides a schematic illustration of an example immersion coating process.

[0023] FIG. 4 provides a schematic illustration of an example roll coating process.

[0024] FIG. 5 provides a schematic illustration of an example battery cell showing various battery components.

DETAILED DESCRIPTION

[0025] Described herein are metal coated substrates and methods for making metal coated substrates. The metal coated substrates may correspond to battery components and may include, for example, a substrate coated with a metal coating, where the metal coating is deposited over the substrate and modifies the surface characteristics of the substrate. For example, surface finish, surface roughness, surface chemistry, surface area, surface material properties, conductivity, or contact resistance may be modified by the metal coating. Advantageously, high conductivity between the substrate and an overlayer may be achieved due to the presence of the metal coating and/or a low contact resistance between the substrate and an overlayer may be achieved due to the presence of the metal coating, for example when compared to a similar substrate and overlayer configuration lacking the metal coating.

[0026] The methods for making coated substrates may include subjecting a substrate to a metal coating process in which metal is deposited over the substrate, such as deposition of aluminum over the substrate. The substrate may be metallic or another material, such as a polymeric material. Optionally, the substrate may have one or more other coatings present on a surface prior to being subjected to the metal coating process. Optionally, the substrate may be coated with one or more other coatings following the metal coating process. The coating may be on one surface of the substrate or on multiple surfaces of the substrate. The coating may be uniformly applied over the substrate or may be applied over discrete and separate areas. The coating may have a uniform thickness or may have a thickness that spatially varies. In some cases, the coating may be formed in a patch-like or patterned arrangement, such as where a connected or continuous network of coated regions is arranged across the surface of the substrate, with other regions of the substrate remaining uncoated.

[0027] For battery components, the substrate may be a current collector or other substrate that is used to provide charge to or from a battery active material. In some examples, the substrate comprises a rolled metal product, such as a metal foil, which is first coated with a metal coating and is then coated with a battery active material. By subjecting a current collector to a metal coating process, surface characteristics of the current collector may be modified, providing a more desirable surface for interaction with the battery active material. For example, the surface area or average surface roughness may be increased after deposition of the metal coating. Optionally, the surface area and/or the average surface roughness may be increased due to the metal coating not having a completely smooth or uniform distribution. For example, in some embodiments, the metal coating may have a higher or lower profile in some regions than in others. The current collector, prior to deposition of the metal coating, may have a base or bare surface profile that is relatively smooth, such as having a surface profile of a rolled or polished metal product. These raised and/or recessed regions may be continuous or discontinuous with the base or bare surface of the current collector and may provide for an overall increase in the surface area due to the stepping or gradually changing profile of the coated surface as compared to the bare or base current collector surface.

Contact resistance and/or conductivity between the substrate and an overlay may be modified due to the presence of the metal coating. For example, the increased surface area may result in higher conductivity or lower contact resistance between the current collector and the battery active material.

[0028] In some cases, the metal coating process may disrupt a surface oxide layer, which may be nonconductive, and thereby modify a conductivity or contact resistance. For example, as the metal coating is deposited over the surface of the substrate, the deposited metal in the metal coating may penetrate through the surface oxide layer. In some cases, the metal coating may be subjected to a compression or calendering process in which components of the metal coating may be pressed into or forced through a surface oxide layer. Optionally, disrupting the surface oxide layer may result in higher conductivity or lower contact resistance between the current collector and the battery active material.

[0029] For use as a current collector or other battery components, it may be desirable for the metal used in the current collector and the metal used in the metal coating to be the same. For example, it may be desirable to subject an aluminum current collector (e.g., a pure aluminum or aluminum alloy current collector) to an aluminum coating process. Similarly, it may be desirable to subject a copper current collector (e.g., a pure copper or copper alloy current collector) to a copper coating process. Use of mismatched metals may be undesirable for some applications, as galvanic reactions may occur.

[0030] For other applications, however, the substrate and the metal coating may comprise different materials. Optionally, it may be desirable to subject steel, copper, magnesium, titanium, or polymeric materials (e.g., plastic) to a metal coating process, such as an aluminum coating process. For example, it may be useful to coat a metal substrate or a polymeric material substrate with aluminum to modify one or more surface characteristics of the substrate. The surface roughness and chemical make-up of the surface may be modified, for example. A surface conductivity may also or alternatively be modified by coating a metal or polymeric substrate with an aluminum coating.

Definitions and Descriptions:

[0031] As used herein, the terms “invention,” “the invention,” “this invention” and “the present invention” are intended to refer broadly to all of the subject matter of this patent application and the claims below. Statements containing these terms should be understood not to limit the subject matter described herein or to limit the meaning or scope of the patent claims below.

[0032] In this description, reference is made to alloys identified by AA numbers and other related designations, such as “series” or “7xxx.” For an understanding of the number designation system most commonly used in naming and identifying aluminum and its alloys, see “International Alloy Designations and Chemical Composition Limits for Wrought Aluminum and Wrought Aluminum Alloys” or “Registration Record of Aluminum Association Alloy Designations and Chemical Compositions Limits for Aluminum Alloys in the Form of Castings and Ingot,” both published by The Aluminum Association.

[0033] Rolled metal products, as used herein, may refer to metal plates, metal shates, or metal sheets, for example. The terms metal sheet and sheet metal explicitly includes metal foils, as well as thicker metal sheets, such as may be used as current collectors in some battery applications.

[0034] As used herein, a plate generally has a thickness of greater than about 15 mm. For example, a plate may refer to an aluminum product having a thickness of greater than about 15 mm, greater than about 20 mm, greater than about 25 mm, greater than about 30 mm, greater than about 35 mm, greater than about 40 mm, greater than about 45 mm, greater than about 50 mm, or greater than about 100 mm.

[0035] As used herein, a shate (also referred to as a sheet plate) generally has a thickness of from about 4 mm to about 15 mm. For example, a shate may have a thickness of about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 10 mm, about 11 mm, about 12 mm, about 13 mm, about 14 mm, or about 15 mm.

[0036] As used herein, a sheet generally refers to an aluminum product having a thickness of less than about 4 mm. For example, a sheet may have a thickness of less than about 4 mm, less than about 3 mm, less than about 2 mm, less than about 1 mm, less than about 0.5 mm, or less than about 0.3 mm (e.g., about 0.2 mm). In some embodiments, a sheet may have a thickness of from about 0.005 mm to about 0.2 mm or from about 0.006 mm to about 0.01 mm, and may optionally be referred to as a foil.

[0037] As used herein, terms such as “cast metal product,” “cast product,” “cast alloy product,” and the like are interchangeable and refer to a product produced by direct chill casting (including direct chill co-casting) or semi -continuous casting, continuous casting (including, for example, by use of a twin belt caster, a twin roll caster, a block caster, or any other continuous caster), electromagnetic casting, hot top casting, or any other casting method. Reference to a particular metal (e.g., an aluminum alloy), may identify a major component of the metal product.

[0038] As used herein, the meaning of “room temperature” can include a temperature of from about 15 °C to about 30 °C, for example about 15 °C, about 16 °C, about 17 °C, about 18 °C, about 19 °C, about 20 °C, about 21 °C, about 22 °C, about 23 °C, about 24 °C, about 25 °C, about 26 °C, about 27 °C, about 28 °C, about 29 °C, or about 30 °C. As used herein, the meaning of “ambient conditions” can include temperatures of about room temperature, relative humidity of from about 20% to about 100%, and barometric pressure of from about 975 millibar (mbar) to about 1050 mbar. For example, relative humidity can be about 20%, about 21%, about 22%, about 23%, about 24%, about 25%, about 26%, about 27%, about 28%, about 29%, about 30%, about 31%, about 32%, about 33%, about 34%, about 35%, about 36%, about 37%, about 38%, about 39%, about 40%, about 41%, about 42%, about 43%, about 44%, about 45%, about 46%, about 47%, about 48%, about 49%, about 50%, about 51%, about 52%, about 53%, about 54%, about 55%, about 56%, about 57%, about 58%, about 59%, about 60%, about 61%, about 62%, about 63%, about 64%, about 65%, about 66%, about 67%, about 68%, about 69%, about 70%, about 71%, about 72%, about 73%, about 74%, about 75%, about 76%, about 77%, about 78%, about 79%, about 80%, about 81%, about 82%, about 83%, about 84%, about 85%, about 86%, about 87%, about 88%, about 89%, about 90%, about 91%, about 92%, about 93%, about 94%, about 95%, about 96%, about 97%, about 98%, about 99%, about 100%, or anywhere in between. For example, barometric pressure can be about 975 mbar, about 980 mbar, about 985 mbar, about 990 mbar, about 995 mbar, about 1000 mbar, about 1005 mbar, about 1010 mbar, about 1015 mbar, about 1020 mbar, about 1025 mbar, about 1030 mbar, about 1035 mbar, about 1040 mbar, about 1045 mbar, about 1050 mbar, or anywhere in between.

[0039] All ranges disclosed herein are to be understood to encompass any and all subranges subsumed therein. For example, a stated range of “1 to 10” should be considered to include any and all subranges between (and inclusive of) the minimum value of 1 and the maximum value of 10; that is, all subranges beginning with a minimum value of 1 or more, e.g. 1 to 6.1, and ending with a maximum value of 10 or less, e.g., 5.5 to 10. Unless stated otherwise, the expression “up to” when referring to the compositional amount of an element means that element is optional and includes a zero percent composition of that particular element. Unless stated otherwise, all compositional percentages are in weight percent (wt.%).

[0040] As used herein, the meaning of “a,” “an,” and “the” includes singular and plural references unless the context clearly dictates otherwise.

Methods of Producing Substrates

[0041] Metal substrates can be cast using any suitable casting method known to those of ordinary skill in the art. As a few non-limiting examples, the casting process can include a Direct Chill (DC) casting process or a Continuous Casting (CC) process. The continuous casting system can include a pair of moving opposed casting surfaces (e.g., moving opposed belts, rolls or blocks), a casting cavity between the pair of moving opposed casting surfaces, and a molten metal injector. The molten metal injector can have an end opening from which molten metal can exit the molten metal injector and be injected into the casting cavity. [0042] A cast metal product can be processed by any means known to those of ordinary skill in the art. Such processing steps include, but are not limited to, homogenization, hot rolling, cold rolling, solution heat treatment, and optional pre-aging and annealing steps. [0043] The cast metal products described herein can also be used to make products in the form of metal sheets, plates, or other suitable products. For example, a cast metal product may be subjected to one or more hot rolling or cold rolling processes to generate a rolled metal product.

[0044] Nonmetal substrates, such as polymeric, glass, or crystalline substrates, can be prepared using any suitable techniques. Nonlimiting examples of polymeric substrate preparation include extrusion casting, calendar forming, solution deposition, lamination, extrusion coating, and injection molding. Glass substrates may be prepared using various glassblowing techniques, such as float glass processing, cylinder blown sheet processing, and the like. Crystalline substrates may be prepared using various processes, including chemical vapor deposition and generation and slicing of crystal boules.

Methods of Coating Substrates

[0045] Metal substrates and nonmetal substrates can be subjected to one or more metal coating processes to form a metal coated substrate. For example, methods of coating metals and metal alloys, including aluminum, aluminum alloys, magnesium, magnesium alloys, magnesium composites, copper, copper alloys, titanium, titanium alloys, and steel, among others, with metal coatings and the resultant metal coated metals and metal alloys are described herein. In some examples, the metals for use in the methods described herein include aluminum alloys, for example, Ixxx series aluminum alloys, 2xxx series aluminum alloys, 3xxx series aluminum alloys, 4xxx series aluminum alloys, 5xxx series aluminum alloys, 6xxx series aluminum alloys, 7xxx series aluminum alloys, or 8xxx series aluminum alloys. In some examples, the materials for use in the methods described herein include nonferrous materials, including aluminum, aluminum alloys, magnesium, magnesium-based materials, magnesium alloys, magnesium composites, titanium, titanium-based materials, titanium alloys, copper, copper-based materials, composites, sheets used in composites, or any other suitable metal, non-metal or combination of materials Monolithic as well as non- monolithic, such as roll-bonded materials, cladded alloys, clad layers, composite materials, such as but not limited to carbon fiber-containing materials, or various other materials are also useful with the methods described herein. In some examples, aluminum alloys containing iron are useful with the methods described herein. Optionally, a metal substrate or current collector used herein and coated with a metal coating layer may be a copper alloy current collector, such as comprising a copper alloy foil. Optionally, a current collector used herein and coated with a metal coating layer may be an aluminum alloy current collector, such as comprising an aluminum alloy foil.

[0046] By way of non-limiting example, exemplary Ixxx alloys for use in the methods described herein can include AA1100, AA1100A, AA1200, AA1200A, AA1300, AA1110, AA1120, AA1230, AA1230A, AA1235, AA1435, AA1145, AA1345, AA1445, AA1150, AA1350, AA1350A, AA1450, AA1370, AA1275, AA1185, AA1285, AA1385, AA1188, AA1190, AA1290, AA1193, AA1198, or AA1199.

[0047] Non-limiting exemplary 2xxx series alloys for use in the methods described herein can include AA2001, A2002, AA2004, AA2005, AA2006, AA2007, AA2007A, AA2007B, AA2008, AA2009, AA2010, AA2011, AA2011A, AA2111, AA2111A, AA2111B, AA2012, AA2013, AA2014, AA2014A, AA2214, AA2015, AA2016, AA2017, AA2017A, AA2117, AA2018, AA2218, AA2618, AA2618A, AA2219, AA2319, AA2419, AA2519, AA2021, AA2022, AA2023, AA2024, AA2024A, AA2124, AA2224, AA2224A, AA2324, AA2424, AA2524, AA2624, AA2724, AA2824, AA2025, AA2026, AA2027, AA2028, AA2028A, AA2028B, AA2028C, AA2029, AA2030, AA2031, AA2032, AA2034, AA2036, AA2037, AA2038, AA2039, AA2139, AA2040, AA2041, AA2044, AA2045, AA2050, AA2055, AA2056, AA2060, AA2065, AA2070, AA2076, AA2090, AA2091, AA2094, AA2095, AA2195, AA2295, AA2196, AA2296, AA2097, AA2197, AA2297, AA2397, AA2098, AA2198, AA2099, or AA2199.

[0048] Non-limiting exemplary 3xxx series alloys for use in the methods described herein can include AA3002, AA3102, AA3003, AA3103, AA3103A, AA3103B, AA3203, AA3403, AA3004, AA3004A, AA3104, AA3204, AA3304, AA3005, AA3005A, AA3105, AA3105A, AA3105B, AA3007, AA3107, AA3207, AA3207A, AA3307, AA3009, AA3010, AA3110, AA3011, AA3012, AA3012A, AA3013, AA3014, AA3015, AA3016, AA3017, AA3019, AA3020, AA3021, AA3025, AA3026, AA3030, AA3130, or AA3065.

[0049] Non-limiting exemplary 4xxx series alloys for use in the methods described herein can include AA4004, AA4104, AA4006, AA4007, AA4008, AA4009, AA4010, AA4013, AA4014, AA4015, AA4015A, AA4115, AA4016, AA4017, AA4018, AA4019, AA4020, AA4021, AA4026, AA4032, AA4043, AA4043A, AA4143, AA4343, AA4643, AA4943, AA4044, AA4045, AA4145, AA4145A, AA4046, AA4047, AA4047A, or AA4147.

[0050] Non-limiting exemplary 5xxx series alloys for use as the aluminum alloy product can include AA5182, AA5183, AA5005, AA5005A, AA5205, AA5305, AA5505, AA5605, AA5006, AA5106, AA5010, AA5110, AA5110A, AA5210, AA5310, AA5016, AA5017, AA5018, AA5018A, AA5019, AA5019A, AA5119, AA5119A, AA5021, AA5022, AA5023, AA5024, AA5026, AA5027, AA5028, AA5040, AA5140, AA5041, AA5042, AA5043, AA5049, AA5149, AA5249, AA5349, AA5449, AA5449A, AA5050, AA5050A, AA5050C, AA5150, AA5051, AA5051A, AA5151, AA5251, AA5251A, AA5351, AA5451, AA5052, AA5252, AA5352, AA5154, AA5154A, AA5154B, AA5154C, AA5254, AA5354, AA5454, AA5554, AA5654, AA5654A, AA5754, AA5854, AA5954, AA5056, AA5356, AA5356A, AA5456, AA5456A, AA5456B, AA5556, AA5556A, AA5556B, AA5556C, AA5257, AA5457, AA5557, AA5657, AA5058, AA5059, AA5070, AA5180, AA5180A, AA5082, AA5182, AA5083, AA5183, AA5183A, AA5283, AA5283A, AA5283B, AA5383, AA5483, AA5086, AA5186, AA5087, AA5187, or AA5088.

[0051] Non-limiting exemplary 6xxx series alloys for use in the methods described herein can include AA6101, AA6101A, AA6101B, AA6201, AA6201A, AA6401, AA6501, AA6002, AA6003, AA6103, AA6005, AA6005A, AA6005B, AA6005C, AA6105, AA6205, AA6305, AA6006, AA6106, AA6206, AA6306, AA6008, AA6009, AA6010, AA6110, AA6110A, AA6011, AA6111, AA6012, AA6012A, AA6013, AA6113, AA6014, AA6015, AA6016, AA6016A, AA6116, AA6018, AA6019, AA6020, AA6021, AA6022, AA6023, AA6024, AA6025, AA6026, AA6027, AA6028, AA6031, AA6032, AA6033, AA6040, AA6041, AA6042, AA6043, AA6151, AA6351, AA6351A, AA6451, AA6951, AA6053, AA6055, AA6056, AA6156, AA6060, AA6160, AA6260, AA6360, AA6460, AA6460B, AA6560, AA6660, AA6061, AA6061A, AA6261, AA6361, AA6162, AA6262, AA6262A, AA6063, AA6063A, AA6463, AA6463A, AA6763, A6963, AA6064, AA6064A, AA6065, AA6066, AA6068, AA6069, AA6070, AA6081, AA6181, AA6181A, AA6082, AA6082A, AA6182, AA6091, or AA6092.

[0052] Non-limiting exemplary 7xxx series alloys for use in the methods described herein can include AA7011, AA7019, AA7020, AA7021, AA7039, AA7072, AA7075, AA7085, AA7108, AA7108A, AA7015, AA7017, AA7018, AA7019A, AA7024, AA7025, AA7028, AA7030, AA7031, AA7033, AA7035, AA7035A, AA7046, AA7046A, AA7003, AA7004, AA7005, AA7009, AA7010, AA7011, AA7012, AA7014, AA7016, AA7116, AA7122, AA7023, AA7026, AA7029, AA7129, AA7229, AA7032, AA7033, AA7034, AA7036, AA7136, AA7037, AA7040, AA7140, AA7041, AA7049, AA7049A, AA7149,7204, AA7249, AA7349, AA7449, AA7050, AA7050A, AA7150, AA7250, AA7055, AA7155, AA7255, AA7056, AA7060, AA7064, AA7065, AA7068, AA7168, AA7175, AA7475, AA7076, AA7178, AA7278, AA7278A, AA7081, AA7181, AA7185, AA7090, AA7093, AA7095, or AA7099.

[0053] Non-limiting exemplary 8xxx series aluminum alloys for use in the methods described herein can include AA8005, AA8006, AA8007, AA8008, AA8010, AA8011, AA8011A, AA8111, AA8211, AA8112, AA8014, AA8015, AA8016, AA8017, AA8018, AA8019, AA8021, AA8021A, AA8021B, AA8022, AA8023, AA8024, AA8025, AA8026, AA8030, AA8130, AA8040, AA8050, AA8150, AA8076, AA8076A, AA8176, AA8077, AA8177, AA8079, AA8090, AA8091, or AA8093.

[0054] In some examples, the metal substrates used in the methods and battery components may include those comprising recycled materials. For example, in some cases, recycled aluminum alloys, such as from used beverage can (UBC) scrap is used in preparing the metal substrates used in the methods and battery components described herein. In some cases, the metal substrates may include at least 50% of a recycled aluminum, such as equal to or greater than 60%, equal to or greater than 70%, equal to or greater than 80%, or equal to or greater than 90%. The recycled aluminum can comprise UBC scrap containing a mixture of recycled metal from can ends and can bodies. UBC scrap, for example, generally contains a mixture of metal from various alloys, such as metal from can bodies (e.g., 3104, 3004, or other 3xxx aluminum alloy) and can ends (e.g., 5182 or other 5xxx aluminum alloy). Other recycled scrap includes other mixtures of alloys. Recycled scrap can contain other impurities and alloying elements, which end up in the metal product when the recycled scrap is melted and processed into a metal product.

[0055] Optionally, the recycled scrap can be modified with one or more additional elements to prepare the metal substrates. In some examples, it can be desirable to add further magnesium (Mg) and/or other alloying elements to the recycled scrap, which can result in a recycled content alloy with improved castability or improved metallurgical properties of the end metal substrates. For example, added Mg can increase the formability and strength of the metal substrates.

[0056] Optionally, the recycled scrap can be modified with one or more additional elements to prepare the recycled content alloys. In some examples, it can be desirable to add further magnesium (Mg) and/or other alloying elements to the recycled scrap. In the case of adding Mg to a recycled content alloy, this may improve castability and/or improve metallurgical properties of the metal substrate as compared to the recycled scrap without added Mg. In some examples, added Mg can increase the formability and strength of the metal substrate. In some examples, Mg can be added to the recycled scrap to achieve, in a recycled content alloy, a percentage of Mg of from about 0.50% to about 7.0% based on the total weight of the alloy (e.g., from about 1.5% to about 6.0%, from about 2.0% to about 5.0%, from about 2.5% to about 4.5%, or from about 3.0% to about 4.0%).

[0057] In some examples, the alloys described herein include Mg in an amount of from about 0.50% to about 7.0% (e.g., from about 1.0% to about 5.0%, from about 1.4% to about 3.0%, from about 1.5% to about 2.6%, or from about 1.6% to about 2.5%) based on the total weight of the alloy. For example, the alloy can include 0.51%, 0.52%, 0.53%, 0.54%, 0.55%, 0.56%, 0.57%, 0.58%, 0.59%, 0.60%, 0.61%, 0.62%, 0.63%, 0.64%, 0.65%, 0.66%, 0.67%,

0.68%, 0.69%, 0.70%, 0.71%, 0.72%, 0.73%, 0.74%, 0.75%, 0.76%, 0.77%, 0.78%, 0.79%,

0.80%, 0.81%, 0.82%, 0.83%, 0.84%, 0.85%, 0.86%, 0.87%, 0.88%, 0.89%, 0.90%, 0.91%,

0.92%, 0.93%, 0.94%, 0.95%, 0.96%, 0.97%, 0.98%, 0.99%, 1.0%, 1.1%, 1.2%, 1.3%, 1.4%,

1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2.0%, 2.1%, 2.2%, 2.3%, 2.4%, 2.5%, 2.6%, 2.7%, 2.8%,

2.9%, 3.0%, 3.1%, 3.2%, 3.3%, 3.4%, 3.5%, 3.6%, 3.7%, 3.8%, 3.9%, 4.0%, 4.1%, 4.2%,

4.3%, 4.4%, 4.5%, 4.6%, 4.7%, 4.8%, 4.9%, 5.0%, 5.1%, 5.2%, 5.3%, 5.4%, 5.5%, 5.6%,

5.7%, 5.8%, 5.9%, 6.0%, 6.1%, 6.2%, 6.3%, 6.4%, 6.5%, 6.6%, 6.7%, 6.8%, 6.9%, or 7.0%

Mg. All are expressed in wt.%.

[0058] In some examples, the alloys described herein include Cu in an amount of from about 0.01% to about 1.0% (e.g., from about 0.05% to about 1.0%, from about 0.1% to about 0.9%, from about 0.2 to about 0.8%, from about 0.15% to about 0.40%, or from about 0.20% to about 0.35%) based on the total weight of the alloy. For example, the alloy can include 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.10%, 0.11%, 0.12%,

0.13%, 0.14%, 0.15%, 0.16%, 0.17%, 0.18%, 0.19%, 0.20%, 0.21%, 0.22%, 0.23%, 0.24%,

0.25%, 0.26%, 0.27%, 0.28%, 0.29%, 0.30%, 0.31%, 0.32%, 033%, 0.34%, 0.35%, 0.36%, 0.37%, 0.38%, 0.39%, 0.40%, 0.41%, 0.42%, 0.43%, 0.44%, 0.45%, 0.46%, 0.47%, 0.48%,

0.49%, 0.50%, 0.51%, 0.52%, 0.53%, 0.54%, 0.55%, 0.56%, 0.57%, 0.58%, 0.59%, 0.60%,

0.61%, 0.62%, 0.63%, 0.64%, 0.65%, 0.66%, 0.67%, 0.68%, 0.69%, 0.70%, 0.71%, 0.72%,

0.73%, 0.74%, 0.75%, 0.76%, 0.77%, 0.78%, 0.79%, 0.80%, 0.81%, 0.82%, 0.83%, 0.84%,

0.85%, 0.86%, 0.87%, 0.88%, 0.89%, 0.90%, 0.91%, 0.92%, 0.93%, 0.94%, 0.95%, 0.96%,

0.97%, 0.98%, 0.99%, or 1.0% Cu. All are expressed in wt.%.

[0059] In some examples, the alloys described herein include iron (Fe) in an amount of from about 0.15% to about 0.8% (e.g., from about 0.25% to about 0.7% or from about 0.3% to about 0.6%) based on the total weight of the alloy. For example, the alloy can include 0.15%, 0.16%, 0.17%, 0.18%, 0.19%, 0.20%, 0.21%, 0.22%, 0.23%, 0.24%, 0.25%, 0.26%, 0.27%, 0.28%, 0.29%, 0.30%, 0.31%, 0.32%, 033%, 0.34%, 0.35%, 0.36%, 0.37%, 0.38%, 0.39%, 0.40%, 0.41%, 0.42%, 0.43%, 0.44%, 0.45%, 0.46%, 0.47%, 0.48%, 0.49%, 0.50%,

0.51%, 0.52%, 0.53%, 0.54%, 0.55%, 0.56%, 0.57%, 0.58%, 0.59%, 0.60%, 0.61%, 0.62%,

0.63%, 0.64%, 0.65%, 0.66%, 0.67%, 0.68%, 0.69%, 0.70%, 0.71%, 0.72%, 0.73%, 0.74%,

0.75%, 0.76%, 0.77%, 0.78%, 0.79%, 0.80% Fe. All are expressed in wt.%.

[0060] In some examples, the alloys described herein include manganese (Mn) in an amount of from about 0.01% to about 1.2% (e.g., from about 0.05% to about 1.0%, from about 0.1% to about 0.9%, or from about 0.2% to about 0.7%) based on the total weight of the alloy. For example, the alloy can include 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.10%, 0.11%, 0.12%, 0.13%, 0.14%, 0.15%, 0.16%, 0.17%, 0.18%,

0.19%, 0.20%, 0.21%, 0.22%, 0.23%, 0.24%, 0.25%, 0.26%, 0.27%, 0.28%, 0.29%, 0.30%,

0.31%, 0.32%, 033%, 0.34%, 0.35%, 0.36%, 0.37%, 0.38%, 0.39%, 0.40%, 0.41%, 0.42%, 0.43%, 0.44%, 0.45%, 0.46%, 0.47%, 0.48%, 0.49%, 0.50%, 0.51%, 0.52%, 0.53%, 0.54%,

0.55%, 0.56%, 0.57%, 0.58%, 0.59%, 0.60%, 0.61%, 0.62%, 0.63%, 0.64%, 0.65%, 0.66%,

0.67%, 0.68%, 0.69%, 0.70%, 0.71%, 0.72%, 0.73%, 0.74%, 0.75%, 0.76%, 0.77%, 0.78%,

0.79%, 0.80%, 0.81%, 0.82%, 0.83%, 0.84%, 0.85%, 0.86%, 0.87%, 0.88%, 0.89%, 0.90%,

0.91%, 0.92%, 0.93%, 0.94%, 0.95%, 0.96%, 0.97%, 0.98%, 0.99%, 1.0%, 1.01%, 1.02%, 1.03%, 1.04%, 1.05%, 1.06%, 1.07%, 1.08%, 1.09%, 1.10%, 1.11%, 1.12%, 1.13%, 1.14%, 1.15%, 1.16%, 1.17%, 1.18%, 1.19%, or 1.20% Mn. All are expressed in wt.%.

[0061] In some examples, the alloys described herein include Si in an amount up to about 1.5 wt.% (e.g., from about 0.01% to about 1.50%, from about 0.20% to about 1.0%, or from about 0.3% to about 0.9%) based on the total weight of the alloy. For example, the alloy can include 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.10%, 0.11%, 0.12%, 0.13%, 0.14%, 0.15%, 0.16%, 0.17%, 0.18%, 0.19%, 0.20%, 0.21%, 0.22%, 0.23%, 0.24%, 0.25%, 0.26%, 0.27%, 0.28%, 0.29%, 0.30%, 0.31%, 0.32%, 033%, 0.34%, 0.35%, 0.36%, 0.37%, 0.38%, 0.39%, 0.40%, 0.41%, 0.42%, 0.43%, 0.44%, 0.45%, 0.46%, 0.47%, 0.48%, 0.49%, 0.50%, 0.51%, 0.52%, 0.53%, 0.54%, 0.55%, 0.56%, 0.57%, 0.58%, 0.59%, 0.60%, 0.61%, 0.62%, 0.63%, 0.64%, 0.65%, 0.66%, 0.67%, 0.68%, 0.69%, 0.70%, 0.71%, 0.72%, 0.73%, 0.74%, 0.75%, 0.76%, 0.77%, 0.78%, 0.79%, 0.80%, 0.81%, 0.82%, 0.83%, 0.84%, 0.85%, 0.86%, 0.87%, 0.88%, 0.89%, 0.90%, 0.91%, 0.92%, 0.93%, 0.94%, 0.95%, 0.96%, 0.97%, 0.98%, 0.99%, 1.0%, 1.01%, 1.02%, 1.03%, 1.04%, 1.05%, 1.06%, 1.07%, 1.08%, 1.09%, 1.10%, 1.11%, 1.12%, 1.13%, 1.14%, 1.15%, 1.16%, 1.17%, 1.18%, 1.19%, 1.20%, 1.21%, 1.22%, 1.23%, 1.24%, 1.25%, 1.26%, 1.27%, 1.28%, 1.29%, 1.30%, 1.31%, 1.32%, 1.33%, 1.34%, 1.35%, 1.36%, 1.37%, 1.38%, 1.39%, 1.40%, 1.41%, 1.42%, 1.43%, 1.44%, 1.45%, 1.46%, 1.47%, 1.48%, 1.49%, or 1.50% Si. In some cases, Si is not present in the alloy (i.e., 0%). All are expressed in wt.%.

[0062] In some examples, the alloys described herein include titanium (Ti) in an amount up to about 0.2% (e.g., from about 0.01% to about 0.15% or from about 0.02% to about 0.1%) based on the total weight of the alloy. For example, the alloy can include 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.10%, 0.11%, 0.12%, 0.13%, 0.14%, 0.15%, 0.16%, 0.17%, 0.18%, 0.19%, or 0.20% Ti. In some cases, Ti is not present in the alloy (i.e., 0%). All are expressed in wt.%.

[0063] In some examples, the alloys described herein include zinc (Zn) in an amount of from about 0% to about 6.0% (e.g., from about 0.01% to about 5.0% or from about 0.02% to about 3.0%) based on the total weight of the alloy. For example, the alloy can include 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.10%, 0.11%, 0.12%, 0.13%,

0.14%, 0.15%, 0.16%, 0.17%, 0.18%, 0.19%, 0.20%, 0.21%, 0.22%, 0.23%, 0.24%, 0.25%,

0.26%, 0.27%, 0.28%, 0.29%, 0.30%, 0.31%, 0.32%, 0.33%, 0.34%, 0.35%, 0.36%, 0.37%,

0.38%, 0.39%, 0.40%, 0.41%, 0.42%, 0.43%, 0.44%, 0.45%, 0.46%, 0.47%, 0.48%, 0.49%,

0.50%, 0.51%, 0.52%, 0.53%, 0.54%, 0.55%, 0.56%, 0.57%, 0.58%, 0.59%, 0.60%, 0.61%,

0.62%, 0.63%, 0.64%, 0.65%, 0.66%, 0.67%, 0.68%, 0.69%, 0.70%, 0.71%, 0.72%, 0.73%,

0.74%, 0.75%, 0.76%, 0.77%, 0.78%, 0.79%, 0.80%, 0.81%, 0.82%, 0.83%, 0.84%, 0.85%,

0.86%, 0.87%, 0.88%, 0.89%, 0.90%, 0.91%, 0.92%, 0.93%, 0.94%, 0.95%, 0.96%, 0.97%,

0.98%, 0.99%, 1.0%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2.0%, 2.1%, 2.2%, 2.3%, 2.4%, 2.5%, 2.6%, 2.7%, 2.8%, 2.9%, 3.0%, 3.1%, 3.2%, 3.3%, 3.4%, 3.5%,

3.6%, 3.7%, 3.8%, 3.9%, 4.0%, 4.1%, 4.2%, 4.3%, 4.4%, 4.5%, 4.6%, 4.7%, 4.8%, 4.9%,

5.0%, 5.1%, 5.2%, 5.3%, 5.4%, 5.5%, 5.6%, 5.7%, 5.8%, 5.9%, or 6.0% Zn. In some cases,

Zn is not present in the alloy (i.e., 0%). All are expressed in wt.%.

[0064] In some examples, the alloys described herein include chromium (Cr) in an amount up to about 0.30% (e.g., from about 0.01% to about 0.25% or from about 0.02% to about 0.1%) based on the total weight of the alloy. For example, the alloy can include 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.10%, 0.11%, 0.12%, 0.13%, 0.14%, 0.15%, 0.16%, 0.17%, 0.18%, 0.19%, 0.20%, 0.21%, 0.22%, 0.23%, 0.24%, 0.25%, 0.26%, 0.27%, 0.28%, 0.29%, or 0.30% Cr. In some cases, Cr is not present in the alloy (i.e., 0%). All are expressed in wt.%.

[0065] In some examples, the alloys described herein include zirconium (Zr) in an amount of from about 0% to about 0.15% (e.g., from about 0.01% to about 0.1% or from about 0.02% to about 0.05%) based on the total weight of the alloy. For example, the alloy can include 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.10%, 0.11%, 0.12%, 0.13%, 0.14%, or 0.15% Zr. In some cases, Zr is not present in the alloy (i.e., 0%). All are expressed in wt.%.

[0066] Optionally, the alloy compositions described herein can further include other minor elements, sometimes referred to as impurities, in amounts of 0.05% or below, 0.04% or below, 0.03% or below, 0.02% or below, or 0.01% or below for each impurity. These impurities may include, but are not limited to, Sn, Ga, Ca, Bi, Na, Pb, Li, W, Mo, Ni, V or combinations thereof. Accordingly, Sn, Ga, Ca, Bi, Na, Pb, Li, W, Mo, Ni, or V may be present in alloys in amounts of 0.05% or below, 0.04% or below, 0.03% or below, 0.02% or below or 0.01% or below. In some cases, the sum of all impurities does not exceed 0.15% (e.g., 0.10%). All expressed in wt.%. The remaining percentage of the alloy beyond any specified elements and impurities may be aluminum.

[0067] In some examples, suitable alloys for use in the metal substrate containing recycled content can be a Ixxx series aluminum alloy, a 2xxx series aluminum alloy, a 3xxx series aluminum alloy, a 4xxx series aluminum alloy, a 5xxx series aluminum alloy, a 6xxx series aluminum alloy, a 7xxx series aluminum alloy, an 8xxx series aluminum alloy, or any combination thereof. The Ixxx, 2xxx, 3xxx, 4xxx, 5xxx, 6xxx, 7xxx, or 8xxx series aluminum alloy can be modified to include amounts of Mg, Cu, Fe, Mn, Si, Ti, Zn, Cr, and/or Zr as described above.

[0068] Methods of coating nonmetal substrates, such as organic, polymeric, and inorganic substrates, with metal coatings and the resultant metal coated nonmetal substrates are also described herein. Examples of nonmetal substrates may include polymeric or plastic substrates, such as acrylic polymers, silicone polymers, vinyl polymers, latex polymers, polyesters, polyurethanes, polycarbonates, polyimides, fluoropolymers, thermoset plastics, or thermoplastics. Other examples of nonmetal substrates may include glasses, such as silicon glasses, fluoride glasses, aluminate and aluminosilicate glasses, phosphate glasses, borate glasses, and chalcogenide glasses. Other examples of nonmetal substrates may include crystalline substrates, such as comprising diamond, silicon, or sapphire, for example.

[0069] FIG. 1 provides a schematic illustration of a process of coating a substrate 100 with a metal coating 105, such as an aluminum coating, via a physical deposition technique. The physical deposition technique may correspond to a vacuum deposition technique, such as plasma-assisted physical vapor deposition, plasma-activated physical vacuum deposition, plasma spray physical vapor deposition, vacuum plasma spraying, or the like. The physical deposition technique may correspond to a thermal spraying technique, such as metal gun- spray deposition, plasma spraying, plasma transferred wire arc spraying, cold spraying, or the like. Other metal coating processes may be alternatively used, including electro-chemical deposition, chemical deposition, sputtering, dip coating, or the like. In some embodiments, an immersion coating process may be useful for forming a metal coating, such as via electrochemical deposition, for example.

[0070] As illustrated, a physical deposition nozzle 110 and a substrate 100 may be moved relative to one another to coat a surface of the substrate 100 with metal coating 105. In some cases, the physical deposition nozzle 110 is moved while the substrate 105 is held stationary. In some cases, the deposition nozzle 110 is held stationary while the substrate 100 is moved. In some cases, both the deposition nozzle 110 and the substrate 100 are moved. Although FIG. 1 shows the metal coating process as being completed in a single pass from right-to-left, other configurations are possible, such as where the deposition nozzle 110 only deposits metal coating 105 over a portion of the substrate 100 and requires multiple relative motions across the substrate 100, such as multiple passes along one or more directions to coat the substrate 100 with metal coating 105. In some cases, the metal coating process may occur as a raster scanning type configuration to provide a complete metal coating 105 coverage over a large part or the entire surface of substrate 100. Optionally, multiple metal coating depositions may take place, such as where the deposition nozzle 110 makes multiple passes over the same region to provide a thicker metal coating 105. Alternatively or additionally, a speed of the relative movement between the deposition nozzle 110 and the substrate 100 may be adjusted to control the deposition time and/or thickness of the metal coating 105, which may be uniform or varied across the length of the substrate 100. In some cases, a relative motion between the deposition nozzle 110 and the substrate 100 is not necessary. For example, some vacuum evaporation deposition techniques may provide for deposition of metal coatings without any moving parts.

[0071] The substrate 100 may have any suitable dimensions, including lateral dimensions and a thickness dimension. For example, lateral dimensions may range from about 1 mm to about 10 m, or more. Optionally, a lateral (e g., length) dimension may be as long as a coil of sheet metal. In some examples, the substrate may have a thickness of from about 0.005 mm to about 10 cm or from about 0.006 mm to about 10 cm. Example thicknesses for the substrate 100 may be from 0.005 mm to 0.01 mm, from 0.005 mm to 0.02 mm, from 0.005 mm to 0.05 mm, from 0.005 mm to 0.1 mm, from 0.005 mm to 0.2 mm, from 0.005 mm to 0.5 mm, from 0.005 mm to 1 mm, from 0.005 mm to 5 mm, from 0.005 mm to 1 cm, from 0.005 mm to 5 cm, from 0.005 mm to 10 cm, from 0.006 mm to 0.01 mm, from 0.006 mm to 0.02 mm, from 0.006 mm to 0.05 mm, from 0.006 mm to 0.1 mm, from 0.006 mm to 0.2 mm, from 0.006 mm to 0.5 mm, from 0.006 mm to 1 mm, from 0.006 mm to 5 mm, from 0.006 mm to 1 cm, from 0.006 mm to 5 cm, from 0.006 mm to 10 cm, from 0.01 mm to 0.02 mm, from 0.01 mm to 0.05 mm, from 0.01 mm to 0.1 mm, from 0.01 mm to 0.2 mm, from 0.01 mm to 0.5 mm, from 0.01 mm to 1 mm, from 0.01 mm to 5 mm, from 0.01 mm to 1 cm, from 0.01 mm to 5 cm, from 0.01 mm to 10 cm, from 0.02 mm to 0.05 mm, from 0.02 mm to 0.1 mm from 0.02 mm to 0.2 mm, from 0.02 mm to 0.5 mm, from 0.02 mm to 1 mm, from 0.02 mm to 5 mm, from 0.02 mm to 1 cm, from 0.02 mm to 5 cm, from 0.02 mm to 10 cm, from 0.05 mm to 0.1 mm, from 0.05 mm to 0.2 mm, from 0.05 to 0.5 mm, from 0.05 mm to 1 mm, from 0.05 mm to 5 mm, from 0.05 mm to 1 cm, from 0.05 mm to 5 cm, from 0.05 mm to 10 cm, from 0.1 mm to 0.2 mm, from 0.1 mm to 0.5 mm, from 0.1 mm to 1 mm, from 0.1 mm to 5 mm, from 0.1 mm to 1 cm, from 0.1 mm to 5 cm, from 0.1 mm to 10 cm, from 0.2 mm to 0.5 mm, from 0.2 mm to 1 mm, from 0.2 mm to 5 mm, from 0.2 mm to 1 cm, from 0.2 mm to 5 cm, from 0.2 mm to 10 cm, from 0.5 mm to 1 mm, from 0.5 mm to 5 mm, from 0.5 mm to 1 cm, from 0.5 mm to 5 cm, from 0.5 mm to 10 cm, from 1 mm to 5 mm, from 1 mm to 1 cm, from 1 mm to 5 cm, from 1 mm to 10 cm, from 5 mm to 1 cm, from 5 mm to 5 cm, from 5 mm to 10 cm, from 1 cm to 5 cm, from 1 cm to 10 cm, or from 5 cm to 10 cm.

[0072] Metal coating 105 may have any suitable dimensions. The metal coating 105 may, for example, cover an entirety of a surface of substrate 100 (e.g., cover full lateral dimensions of substrate 100). Alternatively, metal coating 105 may only cover a portion or portions of the surface of substrate 100. Metal coating 105 may have a thickness, for example, of from about 5 nm to about 100 pm. Example thicknesses for the metal coating 105 may be from 5 nm to 10 nm, from 5 nm to 50 nm, from 5 nm to 100 nm, from 5 nm to 500 nm, from 5 nm to 1 pm, from 5 nm to 5 pm, from 5 nm to 10 pm, from 5 nm to 50 pm, from 5 nm to 100 pm, from 10 nm to 50 nm, from 10 nm to 100 nm, from 10 nm to 500 nm, from 10 nm to 1 pm, from 10 nm to 5 pm, from 10 nm to 10 pm, from 10 nm to 50 pm, from 10 nm to 100 pm, from 50 nm to 100 nm, from 50 nm to 500 nm, from 50 nm to 1 pm, from 50 nm to 5 pm, from 50 nm to 10 pm, from 50 nm to 50 pm, from 50 nm to 100 pm, from 100 nm to 500 nm, from 100 nm to 1 pm, from 100 nm to 5 pm, from 100 nm to 10 pm, from 100 nm to 50 pm, from 100 nm to 100 pm, from 500 nm to 1 pm, from 500 nm to 5 pm, from 500 nm to 10 pm, from 500 nm to 50 pm, from 500 nm to 100 pm, from 1 pm to 5 pm, from 1 pm to 10 pm, from 1 pm to 50 pm, from 1 pm to 100 pm, from 5 pm to 10 pm, from 5 pm to 50 pm, from 5 pm to 100 pm, from 10 pm to 50 pm, from 10 pm to 100 pm, or from 50 pm to 100 pm. Metal coating 105 may have a uniform thickness or may have a non- uniform thickness, such as where different regions of metal coating 105 have different thicknesses.

[0073] Metal coating 105 may exhibit an average surface roughness (Ra) that is different from an average surface roughness of substrate 100. For example, metal coating may exhibit an average surface roughness of from about 0.5 pm to about 10 pm, such as from 0.5 pm to 1 pm, from 0.5 pm to 1.5 pm, from 0.5 pm to 2 pm, from 0.5 pm to 2.5 pm, from 0.5 pm to 3 pm, from 0.5 pm to 3.5 pm, from 0.5 pm to 4 pm, from 0.5 pm to 4.5 pm, from 0.5 pm to 5 pm, from 0.5 pm to 5.5 pm, from 0.5 pm to 6 pm, from 0.5 pm to 6.5 pm, from 0.5 pm to 7 pm, from 0.5 pm to 7.5 pm, from 0.5 pm to 8 pm, from 0.5 pm to 8.5 pm, from 0.5 pm to 9 pm, from 0.5 pm to 9.5 pm, from 0.5 pm to 10 pm, from 1 pm to 1.5 pm, from 1 pm to 2 pm, from 1 pm to 2.5 pm, from 1 pm to 3 pm, from 1 pm to 3.5 pm, from 1 pm to 4 pm, from 1 pm to 4.5 pm, from 1 pm to 5 pm, from 1 pm to 5.5 pm, from 1 pm to 6 pm, from 1 pm to 6.5 pm, from 1 pm to 7 pm, from 1 pm to 7.5 pm, from 1 pm to 8 pm, from 1 pm to 8.5 pm, from 1 pm to 9 pm, from 1 pm to 9.5 pm, from 1 pm to 10 pm, from 1.5 pm to 2 pm, from 1.5 pm to 2.5 pm, from 1.5 pm to 3 pm, from 1.5 pm to 3.5 pm, from 1.5 pm to 4 pm, from 1.5 pm to 4.5 pm, from 1.5 pm to 5 pm, from 1.5 pm to 5.5 pm, from 1.5 pm to 6 pm, from 1.5 pm to 6.5 pm, from 1.5 pm to 7 pm, from 1.5 pm to 7.5 pm, from 1.5 pm to 8 pm, from 1.5 pm to 8.5 pm, from 1.5 pm to 9 pm, from 1.5 pm to 9.5 pm, from 1.5 pm to 10 pm, from 2 pm to 2.5 pm, from 2 pm to 3 pm, from 2 pm to 3.5 pm, from 2 pm to 4 pm, from 2 pm to 4.5 pm, from 2 pm to 5 pm, from 2 pm to 5.5 pm, from 2 pm to 6 pm, from 2 pm to 6.5 pm, from 2 pm to 7 pm, from 2 pm to 7.5 pm, from 2 pm to 8 pm, from 2 pm to 8.5 pm, from 2 pm to 9 pm, from 2 pm to 9.5 pm, from 2 pm to 10 pm, from 2.5 pm to 3 pm, from 2.5 pm to 3.5 pm, from 2.5 pm to 4 pm, from 2.5 pm to 4.5 pm, from 2.5 pm to 5 pm, from 2.5 pm to 5.5 pm, from 2.5 pm to 6 pm, from 2.5 pm to 6.5 pm, from 2.5 pm to 7 pm, from 2.5 pm to 7.5 pm, from 2.5 pm to 8 pm, from 2.5 pm to 8.5 pm, from 2.5 pm to 9 pm, from 2.5 pm to 9.5 pm, from 2.5 pm to 10 pm, from 3 pm to 3.5 pm, from 3 pm to 4 pm, from 3 pm to 4.5 pm, from 3 pm to 5 pm, from 3 pm to 5.5 pm, from 3 pm to 6 pm, from 3 pm to 6.5 pm, from 3 pm to 7 pm, from 3 pm to 7.5 pm, from 3 pm to 8 pm, from 3 pm to 8.5 pm, from 3 pm to 9 pm, from 3 pm to 9.5 pm, from 3 pm to 10 pm, from 3.5 pm to 4 pm, from 3.5 pm to 4.5 pm, from 3.5 pm to 5 pm, from 3.5 pm to 5.5 pm, from 3.5 pm to 6 pm, from 3.5 pm to 6.5 pm, from 3.5 pm to 7 pm, from 3.5 pm to 7.5 pm, from 3.5 pm to 8 pm, from 3.5 pm to 8.5 pm, from 3.5 pm to 9 pm, from 3.5 pm to 9.5 pm, from 3.5 pm to 10 pm, from 4 pm to 4.5 pm, from 4 pm to 5 pm, from 4 pm to 5.5 pm, from 4 pm to 6 pm, from 4 pm to 6.5 pm, from 4 pm to 7 pm, from 4 pm to 7.5 pm, from 4 pm to 8 pm, from 4 pm to 8.5 pm, from 4 pm to 9 pm, from 4 pm to 9.5 pm, from 4 pm to 10 pm, from

4.5 pm to 5 pm, from 4.5 pm to 5.5 pm, from 4.5 pm to 6 pm, from 4.5 pm to 6.5 pm, from

4.5 pm to 7 pm, from 4.5 pm to 7.5 pm, from 4.5 pm to 8 pm, from 4.5 pm to 8.5 pm, from

4.5 pm to 9 pm, from 4.5 pm to 9.5 pm, from 4.5 pm to 10 pm, from 5 pm to 5.5 pm, from 5 pm to 6 pm, from 5 pm to 6.5 pm, from 5 pm to 7 pm, from 5 pm to 7.5 pm, from 5 pm to 8 pm, from 5 pm to 8.5 pm, from 5 pm to 9 pm, from 5 pm to 9.5 pm, from 5 pm to 10 pm, from 5.5 pm to 6 pm, from 5.5 pm to 6.5 pm, from 5.5 m to 7 pm, from 5.5 pm to 7.5 pm, from 5.5 pm to 8 pm, from 5.5 pm to 8.5 pm, from 5.5 pm to 9 pm, from 5.5 pm to 9.5 pm, from 5.5 pm to 10 pm, from 6 pm to 6.5 pm, from 6 pm to 7 pm, from 6 pm to 7.5 pm, from 6 pm to 8 pm, from 6 pm to 8.5 pm, from 6 pm to 9 pm, from 6 pm to 9.5 pm, from 6 pm to 10 pm, from 6.5 pm to 7 pm, from 6.5 pm to 7.5 pm, from 6.5 pm to 8 pm, from 6.5 pm to

8.5 pm, from 6.5 pm to 9 pm, from 6.5 pm to 9.5 pm, from 6.5 pm to 10 pm, from 7 pm to

7.5 pm, from 7 pm to 8 pm, from 7 pm to 8.5 pm, from 7 pm to 9 pm, from 7 pm to 9.5 pm, from 7 pm to 10 pm, from 7.5 pm to 8 pm, from 7.5 pm to 7.5 pm, from 7.5 pm to 9 pm, from 7.5 pm to 9.5 pm, from 7.5 pm to 10 pm, from 8 pm to 8.5 pm, from 8 pm to 9 pm, from 8 pm to 9.5 pm, from 8 pm to 10 pm, from 8.5 pm to 9 pm, from 8.5 pm to 9.5 pm, from 8.5 pm to 10 pm, from 9 pm to 9.5 pm, from 9 pm to 10 pm, or from 9.5 pm to 10 pm. [0074] The average surface roughness for substrate 100 may be smaller than the average surface roughness of the metal coating 105, because the deposition of metal coating 105 may result in raising an average surface height of the surface and the amount the surface height raised may be non-uniform. This may arise due to the mechanics of the coating process used to deposit metal coating 105. For example, physical deposition processes may not achieve a completely spatially homogenous surface or have a spatial homogeneity that is less than the underlying substrate. In some cases, a chemical or electrochemical deposition process may not achieve a completely spatially homogenous surface due to a spatial distribution of surface impurities, a spatial distribution of an oxide layer, fluctuating deposition characteristics (e.g., temperature, pressure, voltage, etc.), or the like. A change in average surface roughness may be an advantageous feature of substrate 100 with metal coating 105. Example average surface roughness for substrate 100 may range from about 0.15 pm to about 5 pm, in some embodiments. In some cases, deposition characteristics may be controlled during deposition so as to increase or achieve a particular surface roughness value.

[0075] Multilayer coatings may also be prepared over a substrate. FIG. 2 provides a schematic overview of coating a substrate 200 with multiple coating layers, including metal coating 205, middle coating 210 (optional), and upper coating 215. Substrate 200 is initially subjected to a metal coating process to form metal coating 205, such as according to FIG. 1, for example. Following the metal coating process, substrate 200 and metal coating 205 are optionally subjected to another coating process to deposit middle coating 210 over metal coating 205. Such a configuration may be useful where metal coating 205 provides advantageous surface characteristics to allow better adhesion or interaction between substrate 200 and middle coating 210, or where middle coating 210 provides for better adhesion or interaction between substrate 200 or metal coating 205 and upper coating 215, or where middle coating 210 provides some level of enhanced performance, such as an improved corrosion resistance level for substrate 200 and/or metal coating 205. Optionally, middle coating 210 comprises a coating that is different from metal coating 205. For example, middle coating 210 may be deposited by the same or a different technique than used to deposit metal coating 205. In embodiments useful for battery applications, middle coating 210 may optionally comprise a conductive layer, a reactive layer, or a corrosion resistance layer. Optionally, middle coating 210 may comprise a carbon, graphite, or conductive polymeric layer. In some embodiments, middle coating 210 may be deposited using a wet processing technique, such as where middle coating 210 is applied as a slurry of material that is heated, annealed, dried, or otherwise allowed to cure over metal coating 205. For example, the slurry may comprise a solution or suspension of material to be deposited in an evaporable solvent that is removed by evaporation during a curing process. Optionally, middle coating 210 is deposited using an immersion coating process or a roll-to-roll coating process.

[0076] Optionally, substrate 200, metal coating 205, and middle coating 210 (if present) are subjected to a further coating process to deposit upper coating 215. Upper coating 215 may, for example, be different from metal coating 205 and/or middle coating 210. For use in battery applications, for example, upper coating 21 may correspond to an electrode active material layer and may comprise an electrode active material and optionally a conductive additive and/or a binder.

[0077] Middle coating 210 (if present) and upper coating 215 may independently have any suitable dimensions, including lateral dimensions and a thickness dimension. For example, lateral dimensions may range from about 1 mm to about 10 m, or more. Optionally, a lateral (e.g., length) dimension may be as long as a coil of sheet metal. In some examples, middle coating 210 or upper coating 215 may have a thickness of from about 0.0005 mm to about 10 cm or from about 0.001 mm to about 10 cm. Example thicknesses for middle coating 210 and/or upper coating 215 may be from 0.0005 mm to 0.001 mm, from 0.0005 mm to 0.002 mm, from 0.0005 mm to 0.005 mm, from 0.0005 mm to 0.01 mm, from 0.0005 mm to 0.02 mm, from 0.0005 mm to 0.05 mm, from 0.0005 mm to 0.1 mm, from 0.0005 mm to 0.2 mm, from 0.0005 mm to 0.5 mm, from 0.0005 mm to 1 mm, from 0.0005 mm to 5 mm, from 0.0005 mm to 1 cm, from 0.0005 mm to 5 cm, from 0.0005 mm to 10 cm, from 0.001 mm to 0.002 mm, from 0.001 mm to 0.005 mm, from 0.001 mm to 0.01 mm, from 0.001 mm to 0.02 mm, from 0.001 mm to 0.05 mm, from 0.001 mm to 0.1 mm, from 0.001 mm to 0.2 mm, from 0.001 mm to 0.5 mm, from 0.001 mm to 1 mm, from 0.001 mm to 5 mm, from 0.001 mm to 1 cm, from 0.001 mm to 5 cm, from 0.001 mm to 10 cm, from 0.002 mm to 0.005 mm, from 0.002 mm to 0.01 mm, from 0.002 mm to 0.02 mm, from 0.002 mm to 0.05 mm, from 0.002 mm to 0.1 mm, from 0.002 mm to 0.2 mm, from 0.002 mm to 0.5 mm, from 0.002 mm to 1 mm, from 0.002 mm to 5 mm, from 0.002 mm to 1 cm, from 0.002 mm to 5 cm, from 0.002 mm to 10 cm, from 0.005 mm to 0.01 mm, from 0.005 mm to 0.02 mm, from 0.005 mm to 0.05 mm, from 0.005 mm to 0.1 mm, from 0.005 mm to 0.2 mm, from 0.005 mm to 0.5 mm, from 0.005 mm to 1 mm, from 0.005 mm to 5 mm, from 0.005 mm to 1 cm, from 0.005 mm to 5 cm, from 0.005 mm to 10 cm, from 0.01 mm to 0.02 mm, from 0.01 mm to 0.05 mm, from 0.01 mm to 0.1 mm, from 0.01 mm to 0.2 mm, from 0.01 mm to 0.5 mm, from 0.01 mm to 1 mm, from 0.01 mm to 5 mm, from 0.01 mm to 1 cm, from 0.01 mm to 5 cm, from 0.01 mm to 10 cm, from 0.02 mm to 0.05 mm, from 0.02 mm to 0.1 mm from 0.02 mm to 0.2 mm, from 0.02 mm to 0.5 mm, from 0.02 mm to 1 mm, from 0.02 mm to 5 mm, from 0.02 mm to 1 cm, from 0.02 mm to 5 cm, from 0.02 mm to 10 cm, from 0.05 mm to 0.1 mm, from 0.05 mm to 0.2 mm, from 0.05 to 0.5 mm, from 0.05 mm to 1 mm, from 0.05 mm to 5 mm, from 0.05 mm to 1 cm, from 0.05 mm to 5 cm, from 0.05 mm to 10 cm, from 0.1 mm to 0.2 mm, from 0.1 mm to 0.5 mm, from 0.1 mm to 1 mm, from 0.1 mm to 5 mm, from 0.1 mm to 1 cm, from 0.1 mm to 5 cm, from 0.1 mm to 10 cm, from 0.2 mm to 0.5 mm, from 0.2 mm to 1 mm, from 0.2 mm to 5 mm, from 0.2 mm to 1 cm, from 0.2 mm to 5 cm, from 0.2 mm to 10 cm, from 0.5 mm to 1 mm, from 0.5 mm to 5 mm, from 0.5 mm to 1 cm, from 0.5 mm to 5 cm, from 0.5 mm to 10 cm, from 1 mm to 5 mm, from 1 mm to 1 cm, from 1 mm to 5 cm, from 1 mm to 10 cm, from 5 mm to 1 cm, from 5 mm to 5 cm, from 5 mm to 10 cm, from 1 cm to 5 cm, from 1 cm to 10 cm, or from 5 cm to 10 cm.

[0078] As noted above, wet coating processes may optionally be used to deposit material over a metal coating. Depending on the configuration, liquid-based coating processes may be used to deposit a metal coating, such as by way of electro-chemical deposition. FIG. 3 provides a schematic illustration of immersion coating of a substrate 300 as it travels along direction 305 and past rollers 310. Substrate 300 may optionally include a metal coating already deposited on one or more surfaces. Substrate 300 may correspond to a rolled metal product, such as a metal sheet or metal foil, for example. As an example, substrate 300 may correspond to a flexible substrate or foil coated with an aluminum coating. Substrate 300 is immersed in bath 315, which may comprise a slurry including material to be coated onto substrate 300. As an example, bath 315 may include a reactive solution that may react with and form a thin coating on substrate 300. For example, bath 315 may be useful for electrochemical or chemical deposition of a coating, such as a metal or other coating, on the surface of substrate 300. Optionally, bath 315 may include a slurry of material to be deposited onto substrate 300 and, upon exit from bath 315, substrate 300 may include a coating of the slurry, which may be subjected to curing conditions to allow for the desired coating to be generated. For generating the metal coating by way of an immersion coating process, bath 315 may include chemical components useful for depositing a metal layer. For example, bath 315 may comprise an ionic liquid including aluminum that may be used to electrochemically deposit an aluminum coating over substrate 300.

[0079] As another example of a wet coating process, FIG. 4 provides a schematic illustration of roll coating of a substrate 400 as it travels along direction 405 and past rollers 410. Substrate 400 may optionally include a metal coating already deposited on one or more surfaces. One or more of rollers 410 may be at least partially immersed in mixture 415 for transferring onto substrate 400, such as by one or more roll-to-roll transfer processes. For example, for battery applications, substrate 400 may correspond to an aluminum foil coated with an aluminum coating and mixture 415 may correspond to a slurry including an electrode active material. By the coating process, the electrode active material may be deposited onto a surface of the substrate 400 to form a battery component, such as an electrode and used in assembly of a battery cell, for example.

Methods of Using the Disclosed Metal Coated Substrates

[0080] Metal coated substrates may be used in a variety of applications. For example, the metal coated substrates described herein can be used in automotive applications and other transportation applications, including aircraft and railway applications. For example, the disclosed metal coated substrates can be used to prepare automotive structural parts, such as bumpers, side beams, roof beams, cross beams, pillar reinforcements (e.g., A-pillars, B- pillars, and C-pillars), inner panels, outer panels, side panels, inner hoods, outer hoods, or trunk lid panels. The metal coated substrates and methods described herein can also be used in aircraft or railway vehicle applications, to prepare, for example, external and internal panels. [0081] The metal coated substrates and methods described herein can also be used in electronics applications. For example, the metal coated substrates and methods described herein can be used to prepare housings for electronic devices, including mobile phones and tablet computers. In some examples, the metal coated substrates can be used to prepare housings for the outer casing of mobile phones (e.g., smart phones), tablet bottom chassis, and other portable electronics. Metal coated substrates may also be used directly as electronic components, such as battery components. Metal coated substrates may be used as current collectors in battery applications, for example.

Example Use of Metal Coated Substrates as Battery Components

[0082] FIG. 5 provides a schematic illustration of a battery cell 500. Battery cell 500 includes various components including a first current collector 505, a first active material 510, an electrolyte 515, a separator 520, a second active material 525 and a second current collector 530.

[0083] First active material 510 may correspond, for example, to a cathode, while first current collector 505 may correspond, for example, to a cathode side current collector. Similarly, second active material 525 may correspond, for example, to a cathode, while second current collector 530 may correspond, for example, to a cathode side current collector. For some applications, battery cell 500 may correspond to a lithium ion cell, such as where first active material 510 comprises a lithium ion cathode material (e.g., LiCoth) and second active material 525 comprises a lithium ion anode material (e.g., graphite). Optionally, first current collector 505 may comprise aluminum or an aluminum alloy and second current collector 530 may comprise copper or a copper alloy.

[0084] Either or both of first current collector 505 and second current collector 530 may independently include a metal coating, as described herein. For example, for first current collector 505 comprising aluminum or an aluminum alloy, the metal coating may comprise an aluminum coating. Similarly, for second current collector 530 comprising copper or a copper alloy, the metal coating may comprise a copper coating.

[0085] Battery cell 500 may be constructed as follows. Initially, first current collector 505 may optionally be coated with a metal coating, as described herein, such as using a vacuum deposition, chemical deposition, or electro-chemical deposition technique, for example as described above with reference to FIG 1. First active material 510 may be deposited on first current collector 505, such as including a metal coating, by a roll-to-roll processing technique, such as described above with reference to FIG. 4. First current collector 505 may be or comprise a strip of a rolled metal product, which may be coated with the metal coating as a continuous coating process and then coated with the first active material 510. In a similar fashion, second current collector 530 may optionally be coated with a metal coating, as described herein, such as using a vacuum deposition, chemical deposition, or electro-chemical deposition technique, for example as described above with reference to FIG 1. Second active material 525 may be deposited on second current collector 530, such as including a metal coating, by a roll-to-roll processing technique, such as described above with reference to FIG. 4. Second current collector 530 may be or comprise a strip of rolled metal, which may be coated with the metal coating as a continuous coating process and then coated with the second active material 525. After being coated as continuous strips, first current collector 505 coated with first active material 510 and second current collector 530 coated with second active material 525 may be cut to an appropriate lateral dimensions as first and second electrodes for the battery cell. The first and second electrodes may be assembled with a separator 520 and an amount of electrolyte 515 between the two electrodes. In some embodiments, electrical connections may be made between a cathode terminal of the battery cell 500 and the first current collector 505 and between an anode terminal of the battery cell 500 and the second current collector 530. Depending on the configuration, multiple battery cells 500 may be assembled in a parallel configuration to provide expanded capacity to an overall battery system, or multiple battery cells 500 may be assembled in a series configuration to provide expanded voltage to an overall battery system. Combinations of parallel and series configurations are also contemplated.

[0086] The examples and illustrates provided herein serve to illustrate the present invention without, at the same time, however, constituting any limitation thereof. On the contrary, it is to be clearly understood that resort may be had to various embodiments, modifications and equivalents thereof which, after reading the description herein, may suggest themselves to those skilled in the art without departing from the spirit of the invention.

ILLUSTRATIVE ASPECTS

[0087] As used below, any reference to a series of aspects (e.g., “Aspects 1-4”) or nonenumerated group of aspects (e.g., “any previous or subsequent aspect”) is to be understood as a reference to each of those aspects disjunctively (e.g., “Aspects 1-4” is to be understood as “Aspects 1, 2, 3, or 4 ”). [0088] Aspect l is a battery component, comprising: a current collector comprising a surface; and a metal coating deposited over at least a portion of the surface of the current collector, wherein the metal coating and the current collector comprise a same metal.

[0089] Aspect 2 is the battery component of any previous or subsequent aspect, wherein the current collector comprises a rolled metal product.

[0090] Aspect 3 is the battery component of any previous or subsequent aspect, wherein the current collector comprises aluminum or copper.

[0091] Aspect 4 is the battery component of any previous or subsequent aspect, wherein the current collector comprises an aluminum alloy or a copper alloy.

[0092] Aspect 5 is the battery component of any previous or subsequent aspect, wherein the current collector has a thickness of from 0.005 mm to 0.5 mm.

[0093] Aspect 6 is the battery component of any previous or subsequent aspect, wherein the metal coating exhibits a surface roughness that is greater than that of the surface of the current collector.

[0094] Aspect 7 is the battery component of any previous or subsequent aspect, wherein the metal coating exhibits an average surface roughness (Ra) of from 0.5 pm to 10 pm.

[0095] Aspect 8 is the battery component of any previous or subsequent aspect, wherein the metal coating and the current collector exhibit a collective surface area that is greater than a surface area of the surface of the current collector.

[0096] Aspect 9 is the battery component of any previous or subsequent aspect, wherein the metal coating is deposited using a technique selected from plasma-activated physical vacuum deposition, metal gun-spray deposition, electro-chemical deposition, chemical deposition, or any combination of these.

[0097] Aspect 10 is the battery component of any previous or subsequent aspect, wherein the metal coating has a thickness of from 5 nm to 100 pm.

[0098] Aspect 11 is the battery component of any previous or subsequent aspect, wherein the metal coating completely coats the surface of the current collector or wherein the metal coating partially coats the surface of the current collector.

[0099] Aspect 12 is the battery component of any previous or subsequent aspect, wherein the surface of the current collector comprises an oxide layer.

[0100] Aspect 13 is the battery component of any previous or subsequent aspect, wherein the metal coating disrupts the oxide layer.

[0101] Aspect 14 is the battery component of any previous or subsequent aspect, wherein the metal coating and the current collector are calendered. [0102] Aspect 15 is the battery component of any previous or subsequent aspect, further comprising an electrode active material layer disposed over the metal coating.

[0103] Aspect 16 is the battery component of any previous or subsequent aspect, wherein the electrode active material layer comprises one or more of an electrode active material, a conductive additive, or a binder.

[0104] Aspect 17 is the battery component of any previous or subsequent aspect, wherein the electrode active material layer has a thickness of from 0.1 mm to 50 mm.

[0105] Aspect 18 is the battery component of any previous or subsequent aspect, further comprising a conductive layer between the electrode active material layer and the current collector, wherein the conductive layer comprises one or more of a carbonaceous material or a binder.

[0106] Aspect 19 is the battery component of any previous or subsequent aspect, wherein the conductive layer is positioned between the metal coating and the current collector.

[0107] Aspect 20 is the battery component of any previous or subsequent aspect, wherein the conductive layer is positioned between the electrode active material layer and the metal coating.

[0108] Aspect 21 is the battery component of any previous or subsequent aspect, wherein the conductive layer has a thickness of from 0.5 pm to 10 pm.

[0109] Aspect 22 is the battery component of any previous or subsequent aspect, further comprising a second electrode active material layer, an electrolyte, and a separator, wherein the electrolyte and the separator are positioned between the electrode active material layer and the second electrode active material layer.

[0110] Aspect 23 is a method of making a battery component, the method comprising: providing a current collector comprising a surface; and subjecting the surface of the current collector to a metal coating process to generate a metal coating layer over all or a portion of the surface of the current collector, wherein the metal coating layer and the current collector comprise a same metal.

[0111] Aspect 24 is the method of any previous or subsequent aspect, wherein the metal coating process modifies one or more surface characteristics of the current collector.

[0112] Aspect 25 is the method of any previous or subsequent aspect, wherein the one or more surface characteristics of the current collector comprise a surface area of the current collector, a surface roughness of the current collector, a surface oxide layer, electrical conductivity, thermal conductivity, corrosion resistance, chemical reactivity, electrolyte reactivity, active material reactivity, wetting character, or adhesion character. [0113] Aspect 26 is the method of any previous or subsequent aspect, further comprising: subjecting the current collector or the metal coating layer to a coating process to form a conductive layer, wherein the conductive layer comprises one or more of a carbonaceous material or a binder.

[0114] Aspect 27 is the method of any previous or subsequent aspect, wherein the coating process comprises an immersion coating process or a roll-to-roll coating process.

[0115] Aspect 28 is the method of any previous or subsequent aspect, further comprising: subjecting the current collector and metal coating layer to a coating process to form an electrode active material layer over the metal coating layer.

[0116] Aspect 29 is the method of any previous or subsequent aspect, wherein the coating process comprises an immersion coating process or a roll-to-roll coating process.

[0117] Aspect 30 is the method of any previous or subsequent aspect, wherein the metal coating process comprises plasma-assisted physical vapor deposition, plasma-activated physical vacuum deposition, plasma spray physical vapor deposition, vacuum plasma spraying, metal gun-spray deposition, plasma spraying, plasma transferred wire arc spraying, cold spraying, electro-chemical deposition, chemical deposition, sputtering, dip coating, or any combination thereof.

[0118] Aspect 31 is the method of any previous or subsequent aspect, wherein the battery component is the battery component of any previous or subsequent aspect.

[0119] Aspect 32 is the battery component of any previous or subsequent aspect, prepared using the method of any previous or subsequent aspect.

[0120] Aspect 33 is a coated object, comprising: a substrate; and an aluminum coating deposited over at least a portion of a surface of the substrate, wherein the aluminum coating exhibits a surface roughness that is different from that of the surface of the substrate, and wherein the aluminum coating and the substrate exhibit a collective surface area that is greater than a surface area of the surface of the substrate.

[0121] Aspect 34 is the coated object of any previous or subsequent aspect, wherein the substrate comprises a rolled metal product.

[0122] Aspect 35 is the coated object of any previous or subsequent aspect, wherein the substrate comprises an aluminum alloy, steel, magnesium, copper, a polymer, a glass, a ceramic, or a crystalline material.

[0123] Aspect 36 is the coated object of any previous or subsequent aspect, wherein the aluminum coating is deposited using a technique selected from plasma-assisted physical vapor deposition, plasma-activated physical vacuum deposition, plasma spray physical vapor deposition, vacuum plasma spraying, metal gun-spray deposition, plasma spraying, plasma transferred wire arc spraying, cold spraying, electro-chemical deposition, chemical deposition, sputtering, dip coating, or any combination thereof.

[0124] All patents, publications and abstracts cited above are incorporated herein by reference in their entirety. The foregoing description of the embodiments, including example embodiments and illustrations, has been presented only for the purpose of illustration and description and is not intended to be exhaustive or limiting to the precise forms disclosed.

Numerous modifications, adaptations, and uses thereof will be apparent to those skilled in the art.