METAL-FOIL-CLAD SUBSTRATE, CIRCUIT BOARD, AND SUBSTRATE WITH HEAT-PRODUCING BODY MOUNTED THEREON

Title:

METAL-FOIL-CLAD SUBSTRATE, CIRCUIT BOARD, AND SUBSTRATE WITH HEAT-PRODUCING BODY MOUNTED THEREON

Document Type and Number:

WIPO Patent Application WO/2015/178394

Kind Code:

A1

Abstract:

This metal-foil-clad substrate, which is used to form a circuit board (10) on which a heat-producing body is mounted, comprises the following: a metal foil (4A); a resin layer (5); a heat-dissipating metal plate (7) that dissipates heat produced by a heat-producing body, namely a semiconductor device (1); and an insulator (6). The insulator (6) comprises a cured first resin composition, and the resin layer (5) comprises a cured or solidified second resin composition, said second resin composition being different from the first resin composition. The insulator (6) has affixed sections (61) that are affixed, via bolts (90), to another structure (80) that is separate from the circuit board (10).

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Inventors:

OKASAKA SHU (JP)
KOMIYATANI TOSHIO (JP)
KOIZUMI KOJI (JP)
BABA TAKAYUKI (JP)

Application Number:

PCT/JP2015/064373

Publication Date:

November 26, 2015

Filing Date:

May 19, 2015

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO (JP)

International Classes:

H05K1/02; H01L23/12; H01L23/36; H05K7/14

Foreign References:

JPH04125953A	1992-04-27
JP2011253726A	2011-12-15
JPH0685476A	1994-03-25
JPS5167063A	1976-06-10

Attorney, Agent or Firm:

ASAHI, Kazuo et al. (JP)
Morning ratio One husband (JP)

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