Title:
METAL-LAMINATED FILM AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/215353
Kind Code:
A1
Abstract:
The main purpose of the present invention is to provide a metal-laminated film capable of improving transmission characteristics in a printed circuit board, wherein a metal layer is laminated on at least one surface of a liquid crystal polymer film, and the degree of orientation F of the liquid crystal polymer film at a central portion in the thickness direction is at least 0.31.
Inventors:
HASHIMOTO YUSUKE (JP)
NANBU KOUJI (JP)
KUROKAWA TEPPEI (JP)
ICHIHARA TERUHISA (JP)
NANBU KOUJI (JP)
KUROKAWA TEPPEI (JP)
ICHIHARA TERUHISA (JP)
Application Number:
PCT/JP2021/015640
Publication Date:
October 28, 2021
Filing Date:
April 15, 2021
Export Citation:
Assignee:
TOYO KOHAN CO LTD (JP)
International Classes:
B32B15/08; H05K1/03
Domestic Patent References:
| WO2017199829A1 | 2017-11-23 | |||
| WO2010055613A1 | 2010-05-20 | |||
| WO2017150678A1 | 2017-09-08 |
Foreign References:
| JP2005236196A | 2005-09-02 | |||
| JP2005324466A | 2005-11-24 | |||
| JPH11348178A | 1999-12-21 |
Other References:
KOUJI NANBU，SHINJI OZAWA，HIRONAO OKAYAMA, HIROYUKI IWASHITA: "Development of Cu/LCP clad material by surface activation bonding method", TOYO KOHAN, vol. 35, 1 April 2006 (2006-04-01), pages 19 - 27, XP009531525, ISSN: 0372-3496
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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