Title:
METAL NANOPARTICLE DISPERSION, PROCESS FOR PRODUCING METAL NANOPARTICLE DISPERSION, AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/175417
Kind Code:
A1
Abstract:
Provided is a metal nanoparticle dispersion which renders low-temperature (e.g., 200°C or lower) bonding possible and which can make the bonded part have satisfactory mechanical properties and electrical properties. The metal nanoparticle dispersion comprises metal nanoparticles in which at least some of the surface has been coated with a C8 or higher amine (A) and a dispersion medium for dispersing the metal nanoparticles, wherein the dispersion medium contains an amine (B) which is a primary, secondary, or tertiary, C7 or lower amine and is a linear alkylamine or alkanolamine.
Inventors:
ENDOH KEIICHI (JP)
MIYOSHI HIROMASA (JP)
HINOTSU TAKASHI (JP)
KURITA SATORU (JP)
KOHNO YOSHIKO (JP)
MIYOSHI HIROMASA (JP)
HINOTSU TAKASHI (JP)
KURITA SATORU (JP)
KOHNO YOSHIKO (JP)
Application Number:
PCT/JP2014/061678
Publication Date:
October 30, 2014
Filing Date:
April 25, 2014
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F9/00; B22F1/0545; B22F1/102; H01B1/00; H01B1/22; H01B13/00; H01R43/00; B22F9/24
Foreign References:
| JP2008150701A | 2008-07-03 | |||
| JP2009161808A | 2009-07-23 | |||
| JP3942816B2 | 2007-07-11 | |||
| JP4928639B2 | 2012-05-09 |
Other References:
See also references of EP 2990142A4
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
Ani store Setsuo (JP)
Ani store Setsuo (JP)
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