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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR DETERMINING SIZE OF WAFER PATTERN, DEVICE, MEDIUM AND PROGRAM PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/137622
Kind Code:
A1
Abstract:
A method (300) and apparatus (600) for determining the size of a wafer pattern, a device (700), a medium and a program product. The method (300) for determining the size of a wafer pattern comprises: generating, on the basis of at least a test light intensity distribution data set and a wafer pattern data set for at least one test pattern, a development model (306) for determining the size of a wafer pattern, wherein each piece of test light intensity distribution data in the test light intensity distribution data set (210) indicates light intensity distribution of a light source of a lithography device on a wafer via a corresponding test pattern, and each piece of wafer pattern data in the wafer pattern data set (220) indicates the size of the wafer pattern corresponding to the corresponding test pattern; and determining, on the basis of at least target light intensity distribution data for a target pattern, the size (308) of the wafer pattern corresponding to the target pattern by using the development model, the target light intensity distribution data (230) indicating the light intensity distribution of the light source on the wafer via the target pattern. In this way, the prediction accuracy of the actual pattern size obtained on the wafer can be improved.

Inventors:
CHENG LONG (CN)
REN QIAN (CN)
SUN YONGQIAN (CN)
MING YONG (CN)
CHEN FEIHONG (CN)
YANG MIN (CN)
Application Number:
PCT/CN2022/072733
Publication Date:
July 27, 2023
Filing Date:
January 19, 2022
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G03F1/36
Foreign References:
CN109283798A2019-01-29
US20020078430A12002-06-20
CN107908071A2018-04-13
CN105223773A2016-01-06
CN110221513A2019-09-10
CN104570586A2015-04-29
Attorney, Agent or Firm:
KING & WOOD MALLESONS (CN)
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