Title:
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2014/127027
Kind Code:
A3
Abstract:
The present invention provides a method for plasma dicing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing a work piece onto the work piece support, said work piece having a support film, a frame and the substrate; loading the work piece onto the work piece support; applying a tensional force to the support film; clamping the work piece to the work piece support; generating a plasma using the plasma source; and etching the work piece using the generated plasma.
Inventors:
GAULDIN RICH (US)
JOHNSON CHRIS (US)
JOHNSON DAVID (US)
MARTINEZ LINNELL (US)
PAYS-VOLARD DAVID (US)
WESTERMAN RUSSELL (US)
GRIVNA GORDON M (US)
JOHNSON CHRIS (US)
JOHNSON DAVID (US)
MARTINEZ LINNELL (US)
PAYS-VOLARD DAVID (US)
WESTERMAN RUSSELL (US)
GRIVNA GORDON M (US)
Application Number:
PCT/US2014/016074
Publication Date:
November 27, 2014
Filing Date:
February 12, 2014
Export Citation:
Assignee:
PLASMA THERM LLC (US)
International Classes:
H01L21/3065; H01J37/32; H01L21/67; H01L21/683; H01L21/687; H01L21/78
Domestic Patent References:
| WO2012125560A2 | 2012-09-20 |
Foreign References:
| US20100216313A1 | 2010-08-26 | |||
| US20100048001A1 | 2010-02-25 | |||
| US5880924A | 1999-03-09 | |||
| US4230515A | 1980-10-28 | |||
| US20020019066A1 | 2002-02-14 |
Attorney, Agent or Firm:
KAUGET, Harvey, S. (201 North Franklin StreetSuite 320, Tampa FL, US)
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