Title:
METHOD AND ARTICLE FOR MICROWAVE BONDING OF SPLICE CLOSURE
Document Type and Number:
WIPO Patent Application WO/1993/010960
Kind Code:
A1
Abstract:
A method and article for microwave bonding of thermplastic closures such as that used in splicing telecommunications wires. The article is a composite bonding material (CBM) having a thermoplastic matrix (preferably polyethylene) which is miscible with the thermoplastic material of the closure, and a plurality of microwave susceptor particles dispersed throughout the matrix. A strip is fashioned from the CBM and may be applied to the sealing edges of the closure. Upon application of microwave energy in an amount sufficient to heat the susceptors and cause both the CBM matrix and the adjacent portion of the closure to melt and flow together, a fusion bond is produced which seals the closure. If the closure is being used with a cable having an inner conductive layer or sheath, a second CBM may be used at this seal, having magnetically reactive susceptors.
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Inventors:
CHAMBERLAIN CRAIG S (US)
DRESSLER DARYL D (US)
FISH BRIAN J (US)
DRESSLER DARYL D (US)
FISH BRIAN J (US)
Application Number:
PCT/US1992/010212
Publication Date:
June 10, 1993
Filing Date:
November 25, 1992
Export Citation:
Assignee:
MINNESOTA MINING & MFG (US)
International Classes:
B29C65/14; B29C65/36; B65D81/34; H02G1/14; H02G15/00; H05B6/80; B29L31/00; B29L31/34; (IPC1-7): B29C65/14; H02G15/00
Foreign References:
| EP0399599A1 | 1990-11-28 | |||
| EP0503794A1 | 1992-09-16 | |||
| US4810829A | 1989-03-07 | |||
| EP0312333A2 | 1989-04-19 |
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