Title:
METHOD OF BONDING WITH ADHESIVE SHEETS FOR HIGH-FREQUENCY DIELECTRIC HEATING
Document Type and Number:
WIPO Patent Application WO/2021/200687
Kind Code:
A1
Abstract:
A bonding method in which an adhesive sheet (10) comprising a first thermoplastic resin and an adhesive sheet (20) comprising a second thermoplastic resin are used, wherein the adhesive sheet (10) has a volume content VA1 of the first thermoplastic resin of 60-100 vol%, the adhesive sheet (20) has a volume content VA2 of the second thermoplastic resin of 60-100 vol%, and changes Vx1 and Vx2 shown by the following expressions are less than 80% each, VB1 being the volume content of the first thermoplastic resin in a layer coming into direct contact with the first adhesive layer (10) and VB2 being the volume content of the second thermoplastic resin in a layer coming into direct contact with the second adhesive layer (20). The bonding method includes a step in which a high-frequency voltage is applied to the adhesive sheets (10, 20) disposed between adherends (110, 120) to bond the adherends. Numerical expression 1: Vx1={(VA1-VB1)/VA1}×100 Numerical expression 2: Vx2={(VA2-VB2)/VA2}×100
Inventors:
TAYA NAOKI (JP)
MIYATA SOU (JP)
MIYATA SOU (JP)
Application Number:
PCT/JP2021/012959
Publication Date:
October 07, 2021
Filing Date:
March 26, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J5/06; B29C65/32; C09J7/10; C09J7/35; C09J11/04; C09J123/00; C09J201/00
Domestic Patent References:
| WO2018186297A1 | 2018-10-11 |
Foreign References:
| JPH08258173A | 1996-10-08 | |||
| JPH08281873A | 1996-10-29 | |||
| JP2014037489A | 2014-02-27 | |||
| JPS58174474A | 1983-10-13 |
Other References:
See also references of EP 4130181A4
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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