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Title:
METHOD AND DEVICE FOR DETECTING CONCENTRATION OF SOLDERING FLUX IN REFLOW OVEN
Document Type and Number:
WIPO Patent Application WO/2023/040617
Kind Code:
A1
Abstract:
A method for detecting the concentration of a soldering flux in a reflow oven, comprising: placing a substrate in a reflow oven, such that a soldering flux volatilized in the reflow oven can be attached to the surface of the substrate and form a soldering flux layer (S1); detecting the thickness of the soldering flux layer (S2); and calculating the concentration of the soldering flux in the reflow oven according to the thickness of the soldering flux layer (S3), thereby solving the problem that the concentration of the soldering flux in the reflow oven cannot be detected. In addition, also provided is a device for detecting the concentration of a soldering flux in a reflow oven.

Inventors:
LV YE (CN)
YANG XIUJUAN (CN)
Application Number:
PCT/CN2022/114774
Publication Date:
March 23, 2023
Filing Date:
August 25, 2022
Export Citation:
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Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
G01B11/06
Foreign References:
CN113547182A2021-10-26
JP2011143435A2011-07-28
CN109900607A2019-06-18
CN211374409U2020-08-28
CN111240384A2020-06-05
CN102665992A2012-09-12
CN112331271A2021-02-05
US20120292376A12012-11-22
CN202111096988A2021-09-18
Other References:
See also references of EP 4227637A4
Attorney, Agent or Firm:
SHENPAT INTELLECTUAL PROPERTY AGENCY (CN)
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