Title:
METHOD FOR FORMING PROTECTIVE FILM USING PLASMA CVD METHOD
Document Type and Number:
WIPO Patent Application WO/2014/103318
Kind Code:
A1
Abstract:
This method for forming a protective film using a plasma cvd method on the surfaces of a plurality of conductive substrates includes the following steps to be performed using a plasma CVD device (1) for implementing this method: a step for dividing the plurality of substrates into two groups, and mounting the substrates inside a vacuum chamber (2) in a state in which the first group and the other group and the chamber are electrically insulated; a step for creating a vacuum state in the interior of the vacuum chamber (2); and a step for forming a protective film on the surfaces of the substrates by supplying the interior of the vacuum chamber (2) with a processing gas containing a deposition gas, and generating a discharge plasma between the substrates by supplying AC power between the two groups of substrates.
Inventors:
TAMAGAKI HIROSHI
HAGA JUNJI
ITO HIROTAKA
HAGA JUNJI
ITO HIROTAKA
Application Number:
PCT/JP2013/007623
Publication Date:
July 03, 2014
Filing Date:
December 26, 2013
Export Citation:
Assignee:
KOBE STEEL LTD (JP)
International Classes:
C23C16/503; C23C16/509
Foreign References:
| JPS62174383A | 1987-07-31 | |||
| JPS622240U | 1987-01-08 | |||
| JPH0551953U | 1993-07-09 | |||
| JP2002504189A | 2002-02-05 | |||
| JP2000096233A | 2000-04-04 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
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