Title:
METHOD OF FORMING THROUGH HOLE IN PHOTOSENSITIVE GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2005/034594
Kind Code:
A1
Abstract:
Many uniform, fine-diameter through holes are formed in a photosensitive glass substrate. A ultraviolet ray (4) is applied onto substrate-form photosensitive glass (1) to form latent images (2), the latent image portions are crystallized by heat-treating, the crystallized portions are removed by etching to form through holes (5), and then the front and rear surfaces of the photosensitive glass (1) are removed up to AA’ and BB’ respectively, whereby the uniformity in the longitudianl direction of through hole bores are kept to within an allowable range.
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Inventors:
HASHIMOTO KAZUAKI (JP)
OZAWA JUN (JP)
MOTOMURA YOSHINARI (JP)
OZAWA JUN (JP)
MOTOMURA YOSHINARI (JP)
Application Number:
PCT/JP2004/013511
Publication Date:
April 14, 2005
Filing Date:
September 16, 2004
Export Citation:
Assignee:
HOYA CORP (JP)
HASHIMOTO KAZUAKI (JP)
OZAWA JUN (JP)
MOTOMURA YOSHINARI (JP)
HASHIMOTO KAZUAKI (JP)
OZAWA JUN (JP)
MOTOMURA YOSHINARI (JP)
International Classes:
C03C4/04; C03C11/00; C03C15/00; C03C19/00; C03C23/00; G03F7/004; H05K3/00; H05K1/03; (IPC1-7): H05K3/00; C03C15/00; C03C23/00
Foreign References:
| JP2001105398A | 2001-04-17 | |||
| JPH02255542A | 1990-10-16 | |||
| JP2003226548A | 2003-08-12 | |||
| JP2000302488A | 2000-10-31 | |||
| JPH1171139A | 1999-03-16 |
Attorney, Agent or Firm:
Aniya, Setuo (4-6-1 Iidabash, Chiyoda-ku Tokyo 72, JP)
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