Title:
METHOD FOR MACHINING DEEP AND MICRO HOLES OF MONOCRYSTALLINE SILICON MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/137821
Kind Code:
A1
Abstract:
A method for machining deep and micro holes of a monocrystalline silicon material, comprising the following steps: step 1, dividing hole machining into five times of cutting, and calculating a single effective cutting depth Q value according to a hole depth L value, the Q value and the L value being shown as follows: Q1=(36%-40%)L, Q2=(26%-30%)L, Q3=(15%-18%)L, Q4=(10%-12%)L, and Q5=(6%-8%)L; step 2, calculating a single cutting duration H, wherein H=Q/F, and F in the equation is a cutting feeding speed; step 3, calculating an ultrasonic frequency M of an ultrasonic vibration generator during a single cutting, wherein M1 is an initial frequency, M2=(70%-50%)M1, M3=(50%-40%)M1, M4=(40%-30%)M1, and M35=(20%-10%)M1; step 4, calculating a feeding distance of a drill bit, the feeding distance comprising rapid feeding and effective feeding, the rapid feeding being a feeding distance of the drill bit before cutting and after cutting, and the effective feeding comprising a height allowance D before effective cutting and an effective cutting depth Q, wherein D＝20%Q; and step 5, machining according to the data above. The method solves the problems of low machining efficiency, poor machined hole wall quality, and poor hole perpendicularity when monocrystalline silicon is mechanically punched.
Inventors:
GUO PENGFEI (CN)
LI SHANWEI (CN)
YANG ZUODONG (CN)
LI SHANWEI (CN)
YANG ZUODONG (CN)
Application Number:
PCT/CN2022/077280
Publication Date:
July 27, 2023
Filing Date:
February 22, 2022
Export Citation:
Assignee:
CHONGQING GENORI IND CO LTD (CN)
International Classes:
B28D5/02; B28D7/00; B28D7/02; B28D7/04
Foreign References:
| JP2008173738A | 2008-07-31 | |||
| CN106001611A | 2016-10-12 | |||
| JP2004066358A | 2004-03-04 | |||
| JPH10202648A | 1998-08-04 |
Attorney, Agent or Firm:
CHONGQING LETAI INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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