Title:
METHOD FOR MANUFACTURING CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2017/094166
Kind Code:
A1
Abstract:
Provided is a conductive paste that is suitable for obtaining a metal microparticle sintered layer having high adhesiveness to an ITO substrate. The conductive paste is manufactured by: dispersing powdery silver oxide in a nonpolar solvent; adding an excessive amount of formic acid thereto and thus treating the powdery silver oxide with formic acid to thereby convert the same into powdery silver formate (HCOOAg); treating the powdery silver formate with a primary amine to give a primary amine addition salt of silver formate; subjecting the primary amine addition salt of silver formate to a reductive decomposition reaction at a liquid temperature of about 70°C to thereby form silver nanoparticles provided with a surface coating layer comprising the primary amine; and adding, to the dispersion of the silver nanoparticles thus obtained, a titanium compound or a manganese compound in an amount of more than 0 part by mass but not more than 2.0 parts by mass per 100 parts by mass of silver.
Inventors:
UEDA MASAYUKI (JP)
Application Number:
PCT/JP2015/084011
Publication Date:
June 08, 2017
Filing Date:
December 03, 2015
Export Citation:
Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
H01B13/00; B22F1/0545; B22F1/102; B22F9/30; B82Y40/00
Domestic Patent References:
| WO2009097269A1 | 2009-08-06 | |||
| WO2006041030A1 | 2006-04-20 |
Foreign References:
| JP2011153362A | 2011-08-11 | |||
| JP2006348160A | 2006-12-28 | |||
| JP2005293937A | 2005-10-20 |
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (JP)
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