METHOD FOR MANUFACTURING CONNECTION ELEMENT, AND ANISOTROPIC ELECTROCONDUCTIVE ADHESIVE

WIPO Patent Application WO/2013/129437

A1

Through the present invention, conductivity is ensured even to an electrode terminal on which an oxide film is formed on the surface thereof, and insulation properties between adjacent wires are also provided. A method for manufacturing a connection element (10) in which an electronic component (18) is connected on a terminal electrode (17) formed on a substrate (12) via an anisotropic electroconductive adhesive (1), wherein the electroconductive adhesive (1) has: a first electroconductive adhesive layer (3) having a binder resin (3a) and first electroconductive particles (4) dispersed in the binder resin (3a); and a second electroconductive adhesive layer (5) layered on one side of the first electroconductive adhesive layer (3), second electroconductive particles (6) having a particle diameter smaller than that of the first electroconductive particles (4) being dispersed in a binder resin (5a) in the second electroconductive adhesive layer (5); and the second electroconductive adhesive layer (5) is bonded on a substrate (12) side.

TANAKA YOSHITO (JP)

PCT/JP2013/055044

September 06, 2013

February 27, 2013

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DEXERIALS CORP (JP)
TANAKA YOSHITO (JP)

H01R43/00; C09J7/10; C09J9/02; C09J11/04; C09J201/00; H01B1/00; H01B1/22; H01B5/16; H01R11/01

JPS6459786A	1989-03-07
JPS6391908A	1988-04-22
JP2006108523A	2006-04-20
JPH1125760A	1999-01-29
JPH08102218A	1996-04-16
JPH11241054A	1999-09-07

KOIKE, Akira et al. (JP)
Akira Koike (JP)

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