Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/019877
Kind Code:
A1
Abstract:
A method is disclosed for manufacturing an electronic component device, the method comprising: a step for preparing a sealing structure that comprises a sealing layer having two opposing main surfaces, an electronic component, and a connection part, the connection part being exposed on a circuit surface, which is one main surface of the sealing layer; a step for preparing a rewiring structure comprising a rewiring part having two opposing main surfaces, and a plurality of bumps; and a step in which the sealing structure and the rewiring structure are affixed with the circuit surface and the plurality of bumps facing each other, with an insulated adhesive layer interposed therebetween, whereby the sealing structure and the rewiring structure are connected.
Inventors:
SHIBATA TOMOAKI (JP)
OGAWA TSUYOSHI (JP)
LI XINRONG (JP)
OGAWA TSUYOSHI (JP)
LI XINRONG (JP)
Application Number:
PCT/JP2020/020129
Publication Date:
February 04, 2021
Filing Date:
May 21, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/00; H01L21/56; H01L23/12; H01L25/04; H01L25/18
Foreign References:
| US20180337135A1 | 2018-11-22 | |||
| JP2014063924A | 2014-04-10 | |||
| JP2007242888A | 2007-09-20 | |||
| JP2012151353A | 2012-08-09 | |||
| JP2013074184A | 2013-04-22 | |||
| JP2013168594A | 2013-08-29 | |||
| JP2010165940A | 2010-07-29 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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