Title:
METHOD FOR MANUFACTURING METAL-PLATED MEMBER, AND METAL-PLATED PROCESSED MEMBER
Document Type and Number:
WIPO Patent Application WO/2024/111272
Kind Code:
A1
Abstract:
Provided are a method for manufacturing a metal-plated member in which joining can be carried out at high bonding strength, and a metal-plated processed member that is joined at high bonding strength. A method for manufacturing a metal-plated member according to the present invention includes joining a metal-plated member, which includes a metal member and a plating layer, to another member, the method being characterized by having: a step (a) for preparing the metal plated member and a member being joined, which serves as the other member; a step (b) for discretely irradiating the surface being joined of the metal-plated member with a laser to form a relief region that includes recesses where the metal member is exposed and protrusions where metal-member-derived substances are positioned on the surface of the plating layer; and a step (c) for overlapping the relief region of the metal-plated member and the member being joined with an adhesive interposed therebetween.
Inventors:
MORI SHINSUKE (JP)
Application Number:
PCT/JP2023/036819
Publication Date:
May 30, 2024
Filing Date:
October 11, 2023
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
B23K26/352; C09J7/28
Domestic Patent References:
| WO2015008771A1 | 2015-01-22 | |||
| WO2013146900A1 | 2013-10-03 | |||
| WO2020261821A1 | 2020-12-30 |
Foreign References:
| JP2017109383A | 2017-06-22 |
Attorney, Agent or Firm:
KIMURA Masayoshi (JP)
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