Title:
METHOD FOR MANUFACTURING PROCESSED SUBSTRATE, METHOD FOR PROCESSING SUBSTRATE, PATTERN FORMATION METHOD, AND CLEANING LIQUID
Document Type and Number:
WIPO Patent Application WO/2024/111391
Kind Code:
A1
Abstract:
The present invention is a method for manufacturing a processed substrate that has a surface with an at least partially modified region, wherein employed is a manufacturing method that includes: a step in which a surface of a substrate (10) is exposed to a surface modifier that contains a compound (A) (20) that can bind to the substrate (10); and a step in which the exposed substrate (10) is cleaned using a cleaning liquid, and a processed substrate (100) is obtained on which a film is formed with the compound (A) (20) controlled in a planar direction and a height direction of the substrate (10). The present invention is characterized in that the cleaning liquid selected for use is a cleaning fluid for which the distance Ra between the Hansen solubility parameter of the compound (A) (20) and the Hansen solubility parameter of the cleaning liquid satisfies the relationship (Ra)2 ≤ 128.
Inventors:
INOMATA KOYA (JP)
TANAKA DAICHI (JP)
TAJIMA KAZUYA (JP)
TANAKA DAICHI (JP)
TAJIMA KAZUYA (JP)
Application Number:
PCT/JP2023/039875
Publication Date:
May 30, 2024
Filing Date:
November 06, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
H01L21/304; C23C16/04; H01L21/316; H01L21/318
Foreign References:
| JP2022098338A | 2022-07-01 | |||
| US20080157363A1 | 2008-07-03 | |||
| KR20110115244A | 2011-10-21 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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