Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD OF MANUFACTURING SPUTTER TARGETS WITH INTERNAL COOLING CHANNELS
Document Type and Number:
WIPO Patent Application WO2002022300
Kind Code:
A8
Abstract:
The present invention pertains to low temperature pressure consolidation methods which provide for bonding of target material (10) to the backing plate material (15) capable of withstanding the stresses imposed by high sputtering rates. The sputter target assemblies (5) in accordance with the present invention are preferably comprised of target materials (10) and backing plate materials (15) having dissimilar thermal expansion coefficients and incorporate internal cooling channels (20). In the preferred embodiment, the resulting bond and the formation of the cooling channels (20) are cooperative.

More Like This:
WO/2011/147432ASSEMBLY COMPRISING A RADIALLY INTERMEDIATE JOINT AND CORRESPONDING METHOD OF JOINING TWO COMPONENTS
JP3509835PRODUCTION OF METAL SUPPORTING PLATE OF RESIN SEAL TYPE ELECTRONIC PART
Inventors:
IVANOV EUGENE Y (US)
Application Number:
PCT/US2001/028411
Publication Date:
August 15, 2002
Filing Date:
September 11, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOSOH SMD INC (US)
IVANOV EUGENE Y (US)
International Classes:
B21K25/00; B23K20/02; C23C14/34; H01J37/34; (IPC1-7): B23K20/12; B23K31/02
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: PLATY TOOL BODY OF LAMINATED STRUCTURE

Next Patent: LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING DEVICE