METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MOUNTING THE DEVICE

Title:

METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MOUNTING THE DEVICE

Document Type and Number:

WIPO Patent Application WO/1998/002919

Kind Code:

A1

Abstract:

A method for manufacturing semiconductor devices includes a resin sealing step of putting a substrate (16) on which bumps (12) and a plurality of semiconductor chips (11) are arranged in the cavity (28) of a mold (20) and supplying a resin (35) to the region where the bumps (12) are provided so as to coat the bumps (12) and form a resin layer (13), a protruded electrode exposing step of exposing at least the front end sections of the bumps (12) coated with the resin layer (13) from the layer (13), and a separating step of separating the semiconductor chips (11) into individual chips (11) by cutting the substrate (16) together with the layer (13).

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Inventors:

FUKASAWA NORIO (JP)
KAWAHARA TOSHIMI (JP)
MORIOKA MUNEHARU (JP)
OSAWA MITSUNADA (JP)
SHINMA YASUHIRO (JP)
MATSUKI HIROHISA (JP)
ONODERA MASANORI (JP)
KASAI JUNICHI (JP)
MARUYAMA SHIGEYUKI (JP)
SAKUMA MASAO (JP)
SUZUKI YOSHIMI (JP)
TAKENAKA MASASHI (JP)

Application Number:

PCT/JP1997/002405

Publication Date:

January 22, 1998

Filing Date:

July 10, 1997

Export Citation:

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Assignee:

FUJITSU LTD (JP)
FUKASAWA NORIO (JP)
KAWAHARA TOSHIMI (JP)
MORIOKA MUNEHARU (JP)
OSAWA MITSUNADA (JP)
SHINMA YASUHIRO (JP)
MATSUKI HIROHISA (JP)
ONODERA MASANORI (JP)
KASAI JUNICHI (JP)
MARUYAMA SHIGEYUKI (JP)
SAKUMA MASAO (JP)
SUZUKI YOSHIMI (JP)
TAKENAKA MASASHI (JP)

International Classes:

B29C43/18; H01L21/56; H01L21/68; H01L23/24; H01L23/31; H01L23/495; H01L23/498; H01L25/065; H01L25/10; H01L29/06; (IPC1-7): H01L21/56; H01L21/60; H01L23/28; B29C43/18

Foreign References:

JPH06151487A	1994-05-31
JPH0555278A	1993-03-05
JPS60130129A	1985-07-11
JPH05175396A	1993-07-13
JPH06318609A	1994-11-15
JPH0629165A	1994-02-04
JPS54111281A	1979-08-31
JPH07326850A	1995-12-12
JPH07321248A	1995-12-08
JPH0520921A	1993-01-29
JPS61253826A	1986-11-11
JPS6437854A	1989-02-08

Other References: