Title:
METHOD FOR MOUNTING COMPONENTS ON MULTI-LAYER WIRING SUBSTRATE HAVING CAVITY
Document Type and Number:
WIPO Patent Application WO/2015/145728
Kind Code:
A1
Abstract:
The following steps are carried out: a solder printing step carried out by a solder printer (42), wherein fiducial marks (18) on a substrate top layer (12) of a multi-layer wiring substrate (11) having a cavity (15) are recognized by means of image processing, solder printing positions are determined relative to the positions of the fiducial marks (18) on the substrate top layer (12), and solder is printed on a land (16) on the substrate top layer (12) and a land (29) in the cavity (15) at the same time or separately; a substrate top layer component mounting step carried out by a component mounting machine (43) after the solder printing step is performed, wherein the fiducial marks (18) on the substrate top layer (12) are recognized by means of image processing, a component mounting position on the substrate top layer (12) is determined relative to the positions of the fiducial marks (18) on the substrate top layer (12), and the component is mounted on that component mounting position; and an in-cavity component mounting step, wherein a specific solder-printed part (32) in the cavity (15) of the multi-layer wiring substrate (11) is recognized by means of image processing, a component mounting position in the cavity (15) is determined relative to the position of the specific solder printed part (32) in the cavity (15), and the component is mounted on that component mounting position.
Inventors:
OTA KATSUSHI (JP)
Application Number:
PCT/JP2014/059157
Publication Date:
October 01, 2015
Filing Date:
March 28, 2014
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
H05K13/04; H05K1/02; H05K3/34; H05K3/46
Foreign References:
| JP2008034589A | 2008-02-14 | |||
| JP2010143227A | 2010-07-01 | |||
| JP2006287062A | 2006-10-19 | |||
| JP2002134899A | 2002-05-10 | |||
| JP2010118389A | 2010-05-27 |
Attorney, Agent or Firm:
KAKO, Muneo (JP)
Muneo Kako (JP)
Muneo Kako (JP)
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