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Title:
METHOD FOR POLISHING BOTH SIDES OF WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2023/248960
Kind Code:
A1
Abstract:
A method, for polishing both sides of a workpiece made of a glass substrate, comprises: (1) a step for starting polishing of the workpiece; (2) a step for monitoring the rotational state of the workpiece in real time; and (3) a step for changing polishing conditions when it is determined in the step (2) above that the rotational state of the workpiece deviates from a predetermined state.

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Inventors:
NAKAO RYO (JP)
YAMAGUCHI RYU (JP)
YAGAWA KEISUKE (JP)
ITO SHOHEI (JP)
Application Number:
PCT/JP2023/022485
Publication Date:
December 28, 2023
Filing Date:
June 16, 2023
Export Citation:
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Assignee:
AGC INC (JP)
International Classes:
B24B37/08; B24B37/00; B24B37/005; B24B37/015; B24B49/10; B24B49/14; C03C19/00
Foreign References:
JPH11254311A1999-09-21
JPH11254304A1999-09-21
JP2002096259A2002-04-02
JP2005259979A2005-09-22
JP2011062776A2011-03-31
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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