Title:
METHOD FOR PRODUCING CONDUCTIVE FILM AND COMPOSITION FOR FORMING CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2014/050466
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for producing a conductive film, which enables the production of a conductive film that exhibits good adhesion to a thermoplastic resin base by pulse light irradiation. A method for producing a conductive film according to the present invention comprises: a coating film formation step wherein a coating film is formed by applying a composition for forming a conductive film onto a thermoplastic resin base, said composition containing copper oxide particles (A), copper particles (B) and an organic polymer (C), with the ratio of the content of the copper particles (B) to the content of the copper oxide particles (A) ((B)/(A)) being 10-50% by mass; and a reduction step wherein a conductive film containing copper is formed by reducing the copper oxide particles (A) by subjecting the coating film to a pulse light irradiation treatment.
Inventors:
KARIYA TOSHIHIRO (JP)
OHTA HIROSHI (JP)
OHTA HIROSHI (JP)
Application Number:
PCT/JP2013/073772
Publication Date:
April 03, 2014
Filing Date:
September 04, 2013
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B13/00; H01B1/00; H01B1/22; H05K1/09; H05K3/12
Domestic Patent References:
| WO2013077448A1 | 2013-05-30 | |||
| WO2003051562A1 | 2003-06-26 |
Foreign References:
| JPS63257107A | 1988-10-25 | |||
| JP2013196881A | 2013-09-30 | |||
| JP2010528428A | 2010-08-19 | |||
| JP2008522369A | 2008-06-26 | |||
| JP2005071805A | 2005-03-17 | |||
| JP2005211732A | 2005-08-11 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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