METHOD FOR PRODUCING ITO SINTERED BODY AND METHOD FOR PRODUCING ITO SPUTTERING TARGET

WIPO Patent Application WO/2011/061916

A1

The disclosed method for producing an ITO sintered body can suppress the occurrence of nodules. The method for producing an ITO sintered body relating to one embodiment of the present disclosures has: a step for sintering a first mixed powder obtained by mixing a first tin oxide powder into a first indium oxide powder having a first specific surface area; a step for preparing a crushed powder having a second specific surface area that is equivalent to or greater than the abovementioned first specific surface area by means of crushing the sintered body of the abovementioned first mixed powder; and a step for sintering a second mixed powder obtained by mixing into the abovementioned crushed powder a second indium oxide powder having a third specific surface area that is equivalent to or greater than the abovementioned first specific surface area, and a second tin oxide powder. In this way, it is possible to obtain an ITO sintered body wherein tin oxide is distributed finely and evenly, and it is possible to greatly suppress the occurrence of nodules compared to conventional methods when using said ITO sintered body in a sputtering target.

YAMADA MASAHARU (JP)
HIDAKA NAOTO (JP)

PCT/JP2010/006694

May 26, 2011

November 15, 2010

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ULVAC INC (JP)
YAMADA MASAHARU (JP)
HIDAKA NAOTO (JP)

C04B35/00; C23C14/34

JP2008285760A	2008-11-27
JP2007230853A	2007-09-13
JPH11100660A	1999-04-13

OMORI, JUNICHI (JP)
Omori Junichi (JP)

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