METHOD FOR THE PRODUCTION OF A CHIP ARRANGEMENT AND VARNISH COMPRISING MAGNETICALLY CONDUCTIVE PARTICLES FOR ELECTRICALLY CONTACTING THE CHIP

Title:

METHOD FOR THE PRODUCTION OF A CHIP ARRANGEMENT AND VARNISH COMPRISING MAGNETICALLY CONDUCTIVE PARTICLES FOR ELECTRICALLY CONTACTING THE CHIP

Document Type and Number:

WIPO Patent Application WO/2004/105119

Kind Code:

A2

Abstract:

The invention relates to a method for the production of a chip arrangement (1) comprising at least two semi-conductor chips (2) having, respectively, at least one electric contact point (3). The semi-conductor chips (2) and a contacting layer (6) are arranged in such a manner that the semi-conductor chips (2) face towards the contact points thereof (3) and the contact points (3) are connected to each other via the contacting layer (6). The contacting layer (6) is made of magnetically conductive particles (4), a first insulating material (5a) and a second insulating material (5b). The particles (4) are covered by the second insulating material (5a) and then, arranged together with the covering in the second insulating material (5a). The insulating materials (5a, 5b) are melted in an area between the contact points (3) by means of heat treatment after the contact point(s) have been coated and the position of at least one particle (4) is altered with the aid of a magnetic field in such a manner that the contact points (3) are electrically connected to each other by the at least one particle (4). The insulating materials (5a, 5b) are then solidified by cooling.

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Inventors:

KLAPPROTH HOLGER (DE)

Application Number:

PCT/EP2004/004879

Publication Date:

December 02, 2004

Filing Date:

May 07, 2004

Export Citation:

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Assignee:

MICRONAS HOLDING GMBH (DE)
KLAPPROTH HOLGER (DE)

International Classes:

C09D5/23; H01L21/60; H01L21/98; H01L25/065; (IPC1-7): H01L21/58

Foreign References:

DE2902002A1	1980-07-31
US4546037A	1985-10-08
US4283591A	1981-08-11

Attorney, Agent or Firm:

Huwer, Andreas (Postfach 1305, Freiburg i.Br., DE)

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