Title:
METHOD FOR SOLDERING MODULE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2006/134891
Kind Code:
A1
Abstract:
[PROBLEMS] A step of soldering a module substrate to a rigid printed wiring board is increasing due to spread of BGA and CSP. However, there is a problem of fusion failure phenomenon wherein continuity failure is caused due to the fact that solder bumps of the module substrate of CSP, BGA and the like do not fuse with a mounting paste, or a lead component do not fuse with a solder paste, even when mounting is performed at a temperature sufficiently over a melting point of a solder alloy, since the printed board warps by reflow heat. [MEANS FOR SOLVING PROBLEMS] At the time of soldering the module substrate on the rigid printed wiring board, after applying a post flux on the module substrate prior to mounting, the solder paste is applied on the rigid printed wiring board and the module substrate is soldered.
Inventors:
SHIMAMURA MASATO (JP)
INABA KO (JP)
OKADA HIROSHI (JP)
OHNISHI TSUKASA (JP)
INABA KO (JP)
OKADA HIROSHI (JP)
OHNISHI TSUKASA (JP)
Application Number:
PCT/JP2006/311790
Publication Date:
December 21, 2006
Filing Date:
June 13, 2006
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
SHIMAMURA MASATO (JP)
INABA KO (JP)
OKADA HIROSHI (JP)
OHNISHI TSUKASA (JP)
SHIMAMURA MASATO (JP)
INABA KO (JP)
OKADA HIROSHI (JP)
OHNISHI TSUKASA (JP)
International Classes:
H05K3/34
Foreign References:
| JP2004221617A | 2004-08-05 | |||
| JP2001284787A | 2001-10-12 |
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