Title:
METHODS OF FORMING ELECTRONIC PACKAGES
Document Type and Number:
WIPO Patent Application WO1991013462
Kind Code:
A3
Abstract:
The present invention relates to the formation of a macrocomposite body by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body and/or a metal or metal containing body. Particularly, an infiltration enhancer and/or infiltration enhancer precursor and/or infiltrating atmosphere are in communication with a filler material or a preform, at least at some point during the process, which permits molten matrix metal to spontaneously infiltrate the filler material or preform. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform, the infiltrated material is bonded to the second material, thereby forming a sealable electronic package.
Inventors:
KECK STEVEN DAVID (US)
ROCAZELLA MICHAEL ANGELO (US)
ENGELGAU PETER MICHAEL (US)
HANNON GREGORY EUGENE (US)
WHITE DANNY RAY (US)
NAGELBERG ALAN SCOTT (US)
ROCAZELLA MICHAEL ANGELO (US)
ENGELGAU PETER MICHAEL (US)
HANNON GREGORY EUGENE (US)
WHITE DANNY RAY (US)
NAGELBERG ALAN SCOTT (US)
Application Number:
PCT/US1991/001247
Publication Date:
October 17, 1991
Filing Date:
February 25, 1991
Export Citation:
Assignee:
LANXIDE TECHNOLOGY CO LTD (US)
International Classes:
C04B35/65; C04B37/02; H01L23/02; C22C1/10; H01L21/48; H01L23/14; H01L23/373; (IPC1-7): H01L21/48; H01L23/373
Foreign References:
| EP0183016A1 | 1986-06-04 | |||
| EP0323945A2 | 1989-07-12 | |||
| EP0332384A2 | 1989-09-13 | |||
| CA1238428A | 1988-06-21 |
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