Title:
MICROELECTROMECHANICAL DEVICE PACKAGES WITH INTEGRAL HEATERS
Document Type and Number:
WIPO Patent Application WO2004106221
Kind Code:
A3
Abstract:
A microelectromechanical device package with integral a heater (220) and a method for packaging the micro-electromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate (210) and second substrate (215), between which a microelectromechanical device, such as a micromirror array device is (105) located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer (230) is deposited, and heated by the heater (220) so as to bond the first and second package substrates together.
Inventors:
TARN TERRY (US)
Application Number:
PCT/US2004/014895
Publication Date:
December 15, 2005
Filing Date:
May 12, 2004
Export Citation:
Assignee:
REFLECTIVITY INC (US)
TARN TERRY (US)
TARN TERRY (US)
International Classes:
B81B7/00; G02B26/08; H01L23/10; (IPC1-7): H01L23/02
Foreign References:
| US6232150B1 | 2001-05-15 | |||
| US20040035840A1 | 2004-02-26 |
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