Title:
MOISTURE-CURABLE HOT-MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2021/230095
Kind Code:
A1
Abstract:
Provided is a moisture-curable hot-melt adhesive capable of combining a satisfactory initial bonding strength with a sufficiently long working time. The moisture-curable hot-melt adhesive includes an alkoxysilyl-group-containing urethane prepolymer (A) which is represented by general formula (a). general formula (a) In (a): A represents a residue after two isocyanate groups have been removed from a divalent diisocyanate; Y represents a residue in which –O–C(=O) –NH–A–NCO has been removed from an isocyanate group terminal urethane prepolymer (a1), which is a reactant between a polyisocyanate (i) and a polyol (ii); n represents a value of 1 to 3; X represents S or NR1; and W represents a residue in which an active hydrogen group of a compound (a2), which includes an alkoxysilyl group and an active hydrogen group, has been removed.
Inventors:
ABE HIROKI (JP)
OKAMURA NAOMI (JP)
OKAMURA NAOMI (JP)
Application Number:
PCT/JP2021/017127
Publication Date:
November 18, 2021
Filing Date:
April 29, 2021
Export Citation:
Assignee:
CEMEDINE CO LTD (JP)
International Classes:
C09J11/06; C09J11/08; C09J133/12; C09J175/06; C09J175/08
Foreign References:
| JP2018016702A | 2018-02-01 | |||
| JP2007063510A | 2007-03-15 | |||
| JP2003306526A | 2003-10-31 | |||
| JP2005232437A | 2005-09-02 | |||
| JP2009533486A | 2009-09-17 | |||
| JP2013082919A | 2013-05-09 |
Attorney, Agent or Firm:
KON Satoshi (JP)
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