Title:
MOLD DISASSEMBLING/ASSEMBLING DEVICE, AND MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/013083
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a mold disassembling/assembling device and a molding device which can reliably perform disassembling and assembling of a mold in a high temperature state and which contribute to an improvement in productivity. The present invention is a device for performing disassembling and assembling of a mold having a drum mold and an upper mold and a lower mold of a smaller diameter than the drum mold, the device comprising an outer sleeve, an upper slide member, and a lower slide member, each of which is made of metal or ceramic. The outer sleeve has an upper side large-diameter hole and a lower side small-diameter hole in a regulating surface, and the upper slide member is slidably inserted into the large-diameter hole from above, and the lower slide member is slidably inserted into the small-diameter hole from below. While a mold is disposed inside the large-diameter hole, the upper slide member presses, with a pressing part thereof, an upper end surface of the drum mold and moves downward until a lower end surface of the drum mold makes contact with the regulating surface, and then the lower slide member is moved downward together with the lower mold, and causes the lower mold to be detached downward from the drum mold.
Inventors:
FUJIMOTO TADAYUKI (JP)
Application Number:
PCT/JP2019/026738
Publication Date:
January 16, 2020
Filing Date:
July 04, 2019
Export Citation:
Assignee:
HOYA CORP (JP)
International Classes:
C03B11/00; C03B11/08
Foreign References:
| JP2006273650A | 2006-10-12 | |||
| JP2006273649A | 2006-10-12 |
Attorney, Agent or Firm:
AOKI, Hiroyoshi et al. (JP)
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