Title:
MOLDING APPARATUS AND METHOD FOR MANUFACTURING MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/071731
Kind Code:
A1
Abstract:
Provided is a molding apparatus capable of manufacturing an inorganic material-containing molded article having improved quality. Provided is a molding apparatus comprising: a supply unit for intermittently or continuously supplying, onto a stage, a precursor containing an inorganic material; a heat source unit including a heat source for thermal sintering, for performing at least thermal sintering on the stage with respect to the precursor supplied from the supply unit; and a control unit for controlling the supply unit and the heat source unit so as to perform thermal sintering of the precursor, to which a heat source for the thermal sintering has already been supplied, during a time period between a start and end of the supply of the precursor by the supply unit.
Inventors:
KINOSHITA YOSHIHIRO (JP)
NARIMATSU EIICHIRO (JP)
NARIMATSU EIICHIRO (JP)
Application Number:
PCT/KR2019/012822
Publication Date:
April 09, 2020
Filing Date:
October 01, 2019
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
B29C64/321; B22F1/102; B22F1/107; B29C64/268; B29C64/295; B29C64/386
Domestic Patent References:
WO2018005350A1 | 2018-01-04 | |||
WO2018005350A1 | 2018-01-04 |
Foreign References:
US20160243619A1 | 2016-08-25 | |||
US20080318189A1 | 2008-12-25 | |||
JP2002038201A | 2002-02-06 | |||
US20050089636A1 | 2005-04-28 | |||
US20160243619A1 | 2016-08-25 | |||
US20080318189A1 | 2008-12-25 | |||
JP2002038201A | 2002-02-06 | |||
US20050089636A1 | 2005-04-28 | |||
JP2018187307A | 2018-11-29 | |||
JP4800074B2 | 2011-10-26 |
Other References:
See also references of EP 3862169A4
Attorney, Agent or Firm:
CHUNG, Soon-Sung (KR)
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