MOLDING MATERIAL AND PROCESS FOR PREPARING THE SAME

Title:

MOLDING MATERIAL AND PROCESS FOR PREPARING THE SAME

Document Type and Number:

WIPO Patent Application WO/1998/020076

Kind Code:

A1

Abstract:

A molding material which is easy to prepare and in which reinforcing fiber bundles are well dispersible in the step of, e.g., injection molding; a process for preparing the same; a polyamide resin composition having a good fluidity, and moldings prepared therefrom. The molding material is characterized by comprising at least the following constituent elements (A), (B), and (C), the constituent element (C) being arranged so as to be in contact with a composite composed of the constituent elements (A) and (B): (A) a continuous reinforcing fiber bundle; (B) a thermoplastic polymer having a weight-average molecular weight of 200 to 50,000 and a lower melt viscosity than the constituent feature (C); and (C) a thermoplastic resin having a weight-average molecular weight of not less than 10,000.

Inventors:

ISHIBASHI SOICHI (JP)
KYONO TETSUYUKI (JP)

Application Number:

PCT/JP1997/004049

Publication Date:

May 14, 1998

Filing Date:

November 06, 1997

Export Citation:

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Assignee:

TORAY INDUSTRIES (JP)
ISHIBASHI SOICHI (JP)
KYONO TETSUYUKI (JP)

International Classes:

B29B9/14; B29C70/50; B32B5/28; C08K7/02; C08K7/14; C08L77/00; C08J5/04; B29C45/00; C08L23/02; (IPC1-7): C08L101/00; C08K7/02; C08L77/00; C08L69/00; C08L23/00; C08L65/00; B29C45/00; B29B11/16

Foreign References:

JPS63239032A	1988-10-05
JPH05124036A	1993-05-21
JPH05263363A	1993-10-12
JPH0649181A	1994-02-22

Other References: