Title:
MULTI-CHEMISTRY ELECTROCHEMICAL PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO2004057060
Kind Code:
A3
Abstract:
Embodiments of the invention generally provide an electrochemical processing system configured to provide multiple chemistries for a single plating process. The multiple chemistries are generally delivered to individual plating cells positioned on the processing system. The individual chemistries may generally be used to conduct direct plating on a barrier layer, alloy plating, plating on a thin seed layer, optimized feature fill and bulk fill plating, plating with minimized defects, and/or any other plating process wherein multiple chemistries may be utilized to take advantage of the desirable characteristics of each chemistry.
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| JP4509968 | Plating equipment |
| JPH0718499 | ELECTROPLATING DEVICE |
| WO/2001/048800 | SEMICONDUCTOR WAFER PROCESSING APPARATUS AND PROCESSING METHOD |
Inventors:
YANG MICHAEL X
XI MING
ELLWANGER RUSSELL C
BRITCHER ERIC B
XI MING
ELLWANGER RUSSELL C
BRITCHER ERIC B
Application Number:
PCT/US2003/040719
Publication Date:
December 01, 2005
Filing Date:
December 18, 2003
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
International Classes:
C25D7/12; H01L21/00; H01L21/288; H01L21/768; (IPC1-7): C25D17/00; C25D5/08; C25D7/12; H01L21/00; H01L21/288; H05K3/24; H05K3/42
Domestic Patent References:
| WO2002068727A2 | 2002-09-06 | |||
| WO2002009484A2 | 2002-01-31 | |||
| WO2002099165A2 | 2002-12-12 |
Foreign References:
| EP1167583A2 | 2002-01-02 | |||
| US6471845B1 | 2002-10-29 | |||
| US6475369B1 | 2002-11-05 | |||
| US5273642A | 1993-12-28 | |||
| US6346479B1 | 2002-02-12 |
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